Semiconductor laser having double heterostructure and method of producing same

ABSTRACT

A semiconductor laser includes a substrate having a (100) face as its main surface, where the substrate has a stripe of a first mesa extending in a &lt;110&gt; direction of the substrate and including a (111)B face as its sloping surface, a buried layer formed on the substrate excluding a top surface of the stripe of the first mesa so that the (111)B face of the stripe of the first mesa is covered a sloping surface part of the buried layer, where the top surface of the stripe of the first mesa is the (100) face of the substrate and forms a stripe of a second mesa together with the sloping surface of the buried layer and the stripe of the second mesa has a smaller inclination than the stripe of the first mesa, and a double heterostructure made up of a plurality of semiconductor layers and formed on the stripe of the second mesa. The double heterostructure has a substantially trapezoidal cross section which is determined by the stripe of the second mesa.

This application is a continuation of application Ser. No. 691,620 filedApr. 25, 1991, now abandoned.

BACKGROUND OF THE INVENTION

The present invention generally relates to semiconductor lasers andmethods of producing the same, and more particularly to a semiconductorlaser which has a double heterostructure and is designed to produce alarge output and to a method of producing such a semiconductor laser.

Presently, as one means for increasing the memory capacity of computersystems, there are proposals to use an optical disk unit or amagneto-optic disk unit as a memory device. Accordingly, there is ademand for a semiconductor laser which can produce a large output sothat the semiconductor laser may be used as a light source when storinginformation on the disk unit with a high density. For example, avisible-light semiconductor laser which emits a laser beam having awavelength in the order of 0.6 μm is suited as the above light source.

Generally, AlGaInP system semiconductor lasers are made using metalorganic vapor phase epitaxy (MOVPE). The reason for using the MOCVD isthat the segregation coefficient of Al is too large and it becomesimpossible to control the Al content when an attempt is made to grow theAlGaInP system semiconductor crystal by liquid phase epitaxy (LPE).

Various structures for controlling the mode f the semiconductor laserhave been proposed and reduced to practice. However, most of theproposed structures are made using the LPE and utilize the growthpeculiarity of the LPE such as the anisotropy. Very few of the proposedstructures use the peculiarity of the MOVPE. In addition, even when anattempt is made to make using the MOVPE the semiconductor laser havingthe structure which is intended to be made by the LPE, it is extremelydifficult to make the semiconductor laser by the MOVPE due to the growthpeculiarity of the MOVPE.

For the above described reasons, there is a need to realize asemiconductor laser structure which is suited to be made utilizing thegrowth peculiarity of the MOVPE. Particularly, the realization of such asemiconductor laser structure is essential in the AlGaInP systemsemiconductor lasers.

The mode control structure of the known semiconductor lasers can roughlybe divided into three kinds.

According to a first kind of mode control structure, a substrate sidecladding layer, an active layer and a surface side cladding layer aresuccessively formed on a flat substrate, and a current confinementstructure for achieving lateral confinement of the current path or aridge structure is formed at a part above the active layer. In thisspecification, this first kind of mode control structure will bereferred to as the ridge type structure.

On the other hand, according to a second kind of mode control structure,a substrate side cladding layer, an active layer and a surface sidecladding layer are successively formed on a flat substrate. Then, a mesaetching is made to a part which is deeper than the active layer, and aburied layer is formed to bury the mesa structure. In thisspecification, this second kind of mode control structure will bereferred to as the buried type structure.

Furthermore, according to a third kind of mode control structure, asubstrate is subjected to a predetermined process to make the substratesurface non-uniform, and a substrate side cladding layer, an activelayer and a surface side cladding layer are successively formed on thenon-uniform substrate surface. In this specification, this third kind ofmode control structure will be referred to as the shaped substrate typestructure.

In the following description, the index of crystal face and the stripedirection are defined as follows. That is, it is known that from thecrystal point of view, there exist a plurality of faces which areequivalent to the (100) face. For example, the (001) face is equivalentto the (100) face, and in this case, the <110> and <110> directions arerespectively equivalent to the <011> and <011> directions. It isconfusing to list all the equivalent faces, and in this specification,the (100) face represents a plurality of faces which are equivalent tothe (100) face, and the stripe directions which correspond to the <011>and <011> stripe directions are respectively represented by the <100>and <110> directions. In addition, the faces which are equivalent to the(111) face which appears at the sloping surface of the conventional mesawhen the conventional mesa stripe is formed on the (100) face in the<011> direction will be represented by the (111)B face. The faces whichare equivalent to the (111) face which appears at the sloping surface ofthe conventional mesa when the conventional mesa stripe is formed on the(100) face in the <011> direction will be represented by the (111)Aface.

FIG. 1 shows a cross section of an essential part of a conventionalsemiconductor laser having the ridge type structure. The semiconductorlaser shown in FIG. 1 includes an n-type GaAs substrate 1, an n-typeAlGaInP cladding layer 2, an InGaP active layer 3, a p-type AlGaInPcladding layer 4, a p-type InGaP buffer layer 5, an n-type GaAs currentconfinement layer 6, a p-type GaAs cap layer 7, a p side electrode 8 andan n side electrode 9.

This ridge type structure is popularly used in the AlGaInP systemsemiconductor lasers for the following reasons. That is, because then-type cladding layer 2 to the p-type cladding layer 5 can besuccessively formed on the substrate 1 in one growth process, there isonly a small possibility of a defect being formed in the active layer 3.Accordingly, it is possible to form a satisfactory doubleheterostructure. In addition, although it is difficult to obtain asatisfactory surface morphology in the case of a layer including Al,there is no need to form an AlGaInP layer on the layer which includesAl. The current confinement structure and an optical waveguide structuredue to loss guide can be realized by simply growing the n-type GaAswhich forms the current confinement layer 6 and the p-type GaAs whichforms the cap layer 7. Therefore, a satisfactory morphology can beobtained after the second and third growth processes because of thegenerally unrestricted range of conditions.

FIG. 2 shows a cross section of an essential part of a conventionalsemiconductor laser using the buried type structure. The semiconductorlaser shown in FIG. 2 includes an n-type GaAs substrate 21, an n-typeAlGaInP cladding layer 22, an InGaP active layer 23, a p-type AlGaInPcladding layer 24, a p-type InGaP buffer layer 25, a semiinsulativeAlInP buried layer 26, a p-type GaAs cap layer 27, a p side electrode 28and an n side electrode 29. In FIG. 2, W denotes a stripe width. Thisburied type structure is popularly used in the InP/InGaAsP systemsemiconductor lasers.

FIG. 3 shows a cross section of an essential part of a conventionalsemiconductor laser using the shaped substrate type structure. Thesemiconductor laser shown in FIG. 3 includes a p-type GaAs substrate 31,an n-type GaAs current confinement layer 32, a p-type InGaP buffer layer33, a p-type AlGaInP cladding layer 34, an InGaP active layer 35, ann-type AlGaInP cladding layer 36 and an n-type GaAs cap layer 37.Presently, this shaped substrate type structure has the mostadvantageous structure from the point of view of producing a largeoutput.

Next, a description will be given of the problems encountered in theconventional semiconductor lasers using the ridge type, buried type andshaped substrate type structures.

The problem of the ridge type structure shown in FIG. 1 is that thisstructure employs the loss guide system. Special circumstances occurringin the case of the AlGaInP system semiconductor laser will now bedescribed in detail.

AlGaInP is a 4-element mixed crystal having a thermal resistance whichis three times that of the AlGaAs system and over seventeen times thatof the InP system. Hence, care should be taken when using AlGaInP sothat a saturation does not occur due to heat. In order to suppress thegeneration of heat so as to prevent the saturation due to the heat, thelength of the cavity is normally made long to reduce the density of thecurrent flowing to the active layer. In addition, the small gain isincreased by use of the long cavity so that it is possible to obtain atotal gain required for the laser oscillation.

However, the loss per unit length is large because this ridge typestructure uses the loss guide system. For this reason, the differentialquantum efficiency η_(d) greatly deteriorates as the cavity lengthbecomes longer as may be seen from the following formula, where η_(i)denotes the internal quantum efficiency, α denotes the waveguide loss, Ldenotes the cavity length, R denotes the reflectivity of the laser edgefacet and 1_(n) denotes the function describing natural logarithm.

    η.sub.d =η.sub.i ×[(1/L)1.sub.n (1/R)]/[α+(1/L)1.sub.n (1/R)]

In other words, when the waveguide loss α is large and the cavity lengthL is large, it can be readily seen from the above formula that thedifferential quantum efficiency η_(d) rapidly approaches zero.

Accordingly, the quantum efficiency of the loss guide system is poor,and it is extremely difficult to produce an output of 50 mW or greaterwhile making the mode control by the loss guide. In addition, the lightabsorption at the n-type GaAs current confinement layer 6 is fed back asheat as the output becomes larger, thereby heating the semiconductorlaser itself and making it difficult to produce a large output.

In order to overcome the above described problems of the ridge typestructure, it is conceivable to carry out both the mode control and thecurrent confinement by forming the current confinement layer 6 from ann-type AlInP which includes a quantity of Al greater than that includedin the p-type AlGaInP cladding layer 4. In this case, however, itbecomes necessary to form a layer which includes Al on a layer whichincludes Al. Normally, the morphology and characteristic of an AlInPlayer is greatly affected by the surface on which the AlInP layer isformed, but generally, Al oxides tend to remain on the surface of thelayer which includes Al. Hence, it is difficult to form the AlInP layeron the layer which includes Al.

Therefore, it is extremely difficult to produce a large output from thesemiconductor laser using the ridge type structure.

On the other hand, various problems occur when the buried type structureshown in FIG. 2 is applied to the AlGaInP system semiconductor laserwhich emits a laser beam having a wavelength in the order of 0.6 μm.First, the stripe width W which guarantees the zeroth transverse mode isnarrow. Normally, in the semiconductor laser which emits a laser beamhaving a wavelength in the order of 1.5 μm, the stripe width W withwhich the transverse mode becomes single is 2 μm or less, but the stripewidth W becomes approximately 1/3 or 1 μm or less in the case of thesemiconductor laser which emits a laser beam having a wavelength in theorder of 0.6 μm. Accordingly, it becomes necessary to carry out a mesaetching by setting the stripe width W to 1 μm or less. Such a mesaetching may be realized using a reactive ion etching (RIE). But when theRIE is used, the crystal surface is damaged and it becomes impossible tosatisfactory grow a layer on the damaged crystal surface. For thisreason, the mesa etching must be made by a wet etching, but it isvirtually impossible to accurately carry out the mesa etching to formthe stripe width W of 1 μm or less with a satisfactory reproducibility.

In addition, the semiinsulative AlInP buried layer 26 must be formed onthe layer which includes Al, similarly as in the case of the ridge typestructure, and it is impossible to satisfactorily form thesemiinsulative AlInP buried layer 26.

Furthermore, in the AlGaInP system semiconductor laser, the energy bandgap of the active layer is large and the voltage applied above and belowthe active layer is high during the operation. For example, the energyband gap of the InGaP active layer 23 is 1.85 eV or greater. Generally,the buried type structure suffers from a problem in that a leak currentflows via the interface state at the interface between the mesa etchedsurface and the buried layer, and the rise of the operation voltagedirectly leads to the increase of the leak current. Moreover, since theburied layer 26 is formed on the layer which includes A1, the interfacestate exists at the interface between the mesa etched surface and theburied layer 26, making it difficult to reduce the leak current, andcauses the decrease of the differential quantum efficiency η_(d). Inaddition, because the stripe width W is made narrow for the transversemode control, the light energy density increases when producing the highoutput, and there is a problem in that a catastrophical optical damage(COD) breakdown easily occurs.

For the above described reasons, the buried type structure also has alarge number of problems to be solved in order to produce a largeoutput, similarly as in the case of the ridge type structure.

Next, the shaped substrate type structure shown in FIG. 3 will bestudied. The shaped substrate type structure does not use the loss guidesystem, but uses the waveguide structure of the index guide by bendingthe active layer so that a small loss is realized. In addition, there isno need to form a layer which includes A1 on a layer which includes A1.Hence, when the peculiarity of the AlGaInP system material isconsidered, the shaped substrate type structure may be best suited forproducing a large output.

A description will be given of a method of producing the conventionalsemiconductor laser using the shaped substrate type structure. Normally,the shape of the substrate surface is formed by one of two methods or acombination thereof. In other words, an etching, a selective growth, ora combination of etching and selective growth may be used to form theshape of the substrate surface.

FIG. 4 shows a cross section of an essential part of the semiconductorlaser using the shaped substrate type structure produced by the etching.The semiconductor laser shown in FIG. 4 includes an n-type GaAssubstrate 41, a p-type GaAs current confinement layer 42, an n-typeAlGaInP cladding layer 43, an InGaP active layer 44, a p-type AlGaInPcladding layer 45, a p-type InGaP buffer layer 46, a p-type GaAs contactlayer 47, a guided light pattern 48 and an absorbing part 49. W denotesthe stripe width, θ denotes the inclination angle of the currentconfinement layer 42, and d denotes the thickness of the cladding layer43.

When producing the semiconductor laser shown in FIG. 4, the p-type GaAscurrent confinement layer 42 is formed on the n-type GaAs substrate 41,and an etching is made in a <111> direction in which a conventional mesacan be formed using a H₂ SO₄ +H₂ O₂ +H₂ O system etchant. Thereafter,the n-type AlGaInP cladding layer 43, the InGaP active layer 44, thep-type AlGaInP cladding layer 45, the p-type InGaP buffer layer 46 andthe p-type GaAs contact layer 47 are successively formed on theconventional mesa structure.

However, the following problems occur.

First, when etching the current confinement layer 42, the inclinationangle θ becomes approximately 50° and large when the normal etchant isused. Hence, the active layer 44 which is formed on above the currentconfinement layer 42 having the large inclination angle θ makes a largecurve. As a result, the difference in the transverse refractive indexeswhich affects the laser beam becomes considerably large, and the stripewidth W which can maintain the single transverse mode becomes 1 μm orless. Consequently, problems similar to those encountered in the buriedtype structure are generated.

Second, when the thickness d of the n-type AlGaInP cladding layer 43 ismade large in order to prevent the guided light from being absorbedwithin the p-type GaAs current confinement layer 42, the thermalresistance increases considerably and it becomes impossible to obtain acontinuous wave (CW) oscillation due to the peculiarity of the AlGaInPsystem material that the thermal resistance thereof is considerablylarge.

Therefore, it was confirmed that it is extremely difficult to producethe semiconductor laser having the shaped substrate type structure bythe etching.

FIGS. 5 and 6 respectively show cross sections of an essential part ofthe semiconductor laser using the shaped substrate type structure atessential stages of the selective growth production process.

As methods of realizing the selective growth, it is possible to use theLPE, MOVPE, molecular beam epitaxy (MBE) and the like. However, it isbetter to form the AlGaInP system material by the MOVPE becauseadditional equipment is required for the mass production when a methodother than the MOVPE is used to form the shape of the shaped substrateand also because the MOVPE is best suited for growing a uniform layer ona large area. Hence, the MOVPE was used to form a layer of the AlGaInPsystem material.

It is desirable to use GaAs or AlGaAs as the material for forming thedesired shape because these materials are lattice matched to GaAs andthe thermal resistance of these materials is small compared to that ofthe AlGaInP system material.

Generally, when selectively growing a GaAs or AlGaAs layer by the MOVPEor growing the GaAs or AlGaAs layer on the shaped substrate, thefollowing facts have been confirmed. For the sake of convenience, it isassumed that the material used is Al_(x) Ga_(1-x) As, where x≦0.3, andis substantially GaAs.

GaAs has a characteristic such that the growth on the surface having(111)B as the index of crystal face is extremely slow. Accordingly, whena GaAs layer is grown in a state where the GaAs substrate is masked inthe <110> direction, the GaAs layer grows on the (111)A face of theconventional mesa but does not grow on the (111)B face of the re-entrantmesa.

FIG. 5 shows the above selective growth of the GaAs layer. Thesemiconductor laser includes a GaAs

substrate 51, a SiO₂ layer 52 and a GaAs layer 53. As shown, the crosssection of the GaAs layer 53 becomes hexagonal by the selective growth.

But when the GaAs layer 53 is grown on the GaAs substrate 51 which ismasked in the <110> direction, the (111)B face forms the conventionalmesa. Hence, the cross section of the GaAs layer 53 becomes trapezoidal,and the growth stops when a vertex part of a triangular cross section isformed.

FIG. 6 shows the formation of the GaAs layer 53 having the triangularcross section. In FIG. 6, those parts which are the same as thosecorresponding parts in FIG. 5 are designated by the same referencenumerals, and a description thereof will be omitted.

The growth characteristics explained in conjunction with FIGS. 5 and 6also holds true when a semiconductor layer is formed on the shapedsubstrate having the mesa structure. For example, when growing thesemiconductor layer on the conventional mesa stripe which extends in the<110> direction, the (111)A face appears at the sloping surface of themesa and the semiconductor layer is grown on the conventional mesastripe including the (111)A face. When growing the semiconductor layeron the conventional mesa stripe which extends in the <110> direction,the mesa stripe has a triangular cross section at the central part andthe semiconductor layer having a gradual sloping surface which is the(311)B face grows from the flat surface and crawls on the mesa sidesurface.

FIG. 7 shows a cross section of a structure for explaining the growth ofthe semiconductor layer on the conventional mesa which is formed by theetching and extends in the <110> direction. The structure shown in FIG.7 includes a substrate 61, a mesa stripe 61A which extends in the <110>direction, a first semiconductor layer 62 and a second semiconductorlayer 63.

FIG. 8 shows a cross section of a structure for explaining the growth ofthe semiconductor layer on the conventional mesa which is formed by theetching and extends in the <110> direction. In FIG. 8, those parts whichare the same as those corresponding parts in FIG. 7 are designated bythe same reference numerals, and a description thereof will be omitted.In this case, the surface of the semiconductor layer 63 which is formedon the mesa stripe 61A has a index of crystal face (100).

For example, a sloping surface having an extremely small angle withrespect to the substrate surface as shown in FIG. 8 is extremelydifficult to form by the etching. However, if a mesa stripe having sucha gradual sloping surface can be formed and applied to the semiconductorlaser having the shaped substrate type structure, it would be possibleto set the stripe width W for maintaining the single transverse mode toa large value and thereby enable a large output to be produced.

FIG. 9 shows a cross section of an essential part of a known GaAs/AlGaAssystem semiconductor laser which is produced using the shaped substratehaving the gradual sloping surface. The semiconductor laser includes ap-type GaAs substrate 61, a p-type GaAs buffer layer 62, a p-type AlGaAsbuffer layer 63, an n-type GaAs current confinement layer 64, a p-typeAlGaAs cladding layer 65, an AlGaAs active layer 66, an n-type AlGaAscladding layer 67, an n-type GaAs contact layer 68, an n side metalelectrode 69 and a p side metal electrode 70. W denotes the stripe widthrequired to maintain the single transverse mode, θ denotes the angleformed by the (100) face and a line which connects an intersection pointof the (100) face and the (111)B face and a line which defines thestripe width W.

According to this semiconductor laser, the layers up to the contactlayer 68 are continuously grown on the substrate 61 indicated by abroken line, and the transverse mode control is made by use of the bendwhere the (100) face and the (311)B face of the active layer 66 meet.

But when the method used to produce the semiconductor laser shown inFIG. 9 is used as it is to produce the AlGaInP system semiconductorlaser, the following problems occur.

That is, as may be seen from FIG. 9, the flat part of the active layer66 spreads with reference to the vertex where the (111)B faces of thesubstrate 61 meet. For this reason, in order to prevent the CODbreakdown even when the large output is produced, it is necessary tomake the cladding layer 65 under the active layer 66 thick. But in theAlGaInP system semiconductor laser, the cladding layer 65 is of coursemade of AlGaInP which is a 4-element material having a large thermalresistance as described above. Therefore, the thermal resistance wouldbecome even larger if the thickness of the cladding layer 65 isincreased, and the CW oscillation would become impossible.

On the other hand, other types of semiconductor lasers have beenproposed in Japanese Laid-Open Patent Applications No.55-158689,No.64-30287 and the like.

FIG. 10 shows a semiconductor laser proposed in the Japanese Laid-OpenPatent Application No.55-158689. This semiconductor layer includes ann-type GaAs substrate 920, a p-type Ga₁₌₁ Al_(x) As current blockinglayer 921, an n-type Ga_(1-x) Al_(x) As cladding layer 922, an n orp-type GaAs active layer 923, a p-type Ga_(1-x) Al_(x) As cladding layer924, a p-type GaAs ohmic contact layer 925, a p mode electrode 926, an nside electrode 927, a triangular prism shaped mesa part 928, a damagedpart 929 and a light emitting region 930.

However, according to this structure, since the angle θ of the mesa part928 is large and the mesa part 928 is formed by the LPE, the activelayer 923 formed thereon greatly curves. For this reason, the stripewidth which in effect determines the waveguide is restricted by the bentpart of the active layer 923, and it is extremely difficult to form theactive layer 923 to a width of 2 μm or greater in this structure.Consequently, the degree of freedom with which the stripe width can becontrolled is extremely small.

On the other hand, FIG. 11 shows shows a semiconductor laser proposed inthe Japanese Laid-Open Patent Application No.64-30287. Thissemiconductor layer includes a p-type GaAs substrate 901, a stripeconvex part 902, a p-type GaAs buffer layer 903, p-type AlGaAs claddinglayers 904 and 906, a current blocking layer 905, an AlGaAs active layer907, an n-type AlGaAs cladding layer 908, an n-type GaAs contact layer909, an n side ohmic electrode 910 and a p side ohmic electrode 911.

This structure basically employs the same principle as the structureshown in FIG. 9, and the stripe width and the thickness of the claddinglayer cannot be selected independently. This structure differs from thatshown in FIG. 9, however, in that the stripe convex part 902 formed onthe substrate 901 has a re-entrant mesa shape. The cladding layer 904which is formed on the substreate 901 grows on the side surface of there-entrant mesa of the stripe convex part 902 and on the (111)B face atthe side surface of the conventional mesa at the upper part of thestripe convex part 902. However, when the side surface of the re-entrantmesa and the side surface of the conventional mesa in the stripe convexpart 902 have completely different indexes of crystal face, it was foundfrom the experiments conducted by the present inventors that themorphology of the cladding layer 904 at such side surfaces becomesextremely poor. The present inventors have also found from otherexperiments that the morphology of a layer is satisfactory when thelayer is grown on a side surface which is made up of only the (111)Bface on which the layer growth is slow. For the above described reasons,it is difficult to produce a smooth stripe structure in thesemiconductor laser proposed in the Japanese Laid-Open PatentApplication No.64-30287. Furthermore, since the scattering loss islarge, it is impossible to produce a large output from thissemiconductor laser. It was also found from the experiments conducted bythe present inventors that the side surface of the mesa is desirablymade up solely of the (111)B face.

For the foregoing reasons, there is a problem in that the semiconductorlasers shown in FIGS. 10 and 11 are also unsuited for producing a largeoutput.

Another semiconductor laser having the mesa structure is also proposedin a Japanese Laid-Open Patent Application No.64-32692. However,illustration and description thereof will be omitted in thisspecification because the proposed structure is basically similar to thestructure shown in FIG. 11.

SUMMARY OF THE INVENTION

Accordingly, it is a general object of the present invention to providenovel and useful semiconductor laser and method of producing the same,in which the problems described above are eliminated.

Another and more specific object of the present invention is to providea semiconductor laser comprising a substrate having a (100) face as itsmain surface, where the substrate has a stripe of a first mesa extendingin a <110> direction of the substrate and including a (111)B face as itssloping surface, a buried layer formed on the substrate excluding a topsurface of the stripe of the first mesa so that the (111)B face of thestripe of the first mesa is covered a sloping surface part of the buriedlayer, where the top surface of the stripe of the first mesa is the(100) face of the substrate and forms a stripe of a second mesa togetherwith the sloping surface of the buried layer and the stripe of thesecond mesa has a smaller inclination than the stripe of the first mesa,and a double heterostructure made up of a plurality of semiconductorlayers and formed on the stripe of the second mesa, where the doubleheterostructure has a substantially trapezoidal cross section which isdetermined by the stripe of the second mesa. According to thesemiconductor laser of the present invention, it is possible to make thestripe width sufficiently wide even when the cladding layer under theactive layer is made thin so as to improve the heat release because thestripe width is determined by the stripe of the second mesa. Hence, thesingle transverse mode control can be made satisfactorily, and thepresent invention is particularly suited for the production of anAlGaInP system semiconductor laser using the MOVPE.

Still another object of the present invention is to provide a method ofproducing a semiconductor laser comprising the steps of patterning adielectric layer which is formed on a (100) face of a substrate into astripe, forming a stripe of a first mesa by making a mesa etching of thesubstrate using the stripe of the dielectric layer as a mask, where thestripe of the first mesa includes a (111)B face as its sloping surface,removing eaves of the dielectric layer which is used as the mask in theprevious step by an etching, forming a buried layer by a metal organicvapor phase epitaxy (MOVPE) using the remaining dielectric layer as amask so that the buried layer is formed on the substrate excluding a topsurface of the stripe of the first mesa and the (111)B face of thestripe of the first mesa is covered a sloping surface part of the buriedlayer, where the top surface of the stripe of the first mesa is the(100) face of the substrate and forms a stripe of a second mesa togetherwith the sloping surface of the buried layer and the stripe of thesecond mesa has a smaller inclination than the stripe of the first mesa,removing the dielectric layer by an etching, and forming a doubleheterostructure made up of a plurality of semiconductor layers on thestripe of the second mesa by a metal organic vapor phase epitaxy(MOVPE). According to the method of the present invention, it ispossible to make the stripe width sufficiently wide even when thecladding layer under the active layer is made thin so as to improve theheat release because the stripe width is determined by the stripe of thesecond mesa. Hence, the single transverse mode control can be madesatisfactorily, and the present invention is particularly suited for theproduction of an AlGaInP system semiconductor laser using the MOVPE.

A further object of the present invention is to provide a method ofproducing a semiconductor laser comprising the steps of patterning adielectric layer which is formed on a main surface of a substrate into astripe, forming a stripe of a first mesa by making a mesa etching of thesubstrate using the stripe of the dielectric layer as a mask, where thestripe of the first mesa has a top surface and a sloping surface,removing eaves of the dielectric layer which is used as the mask in theprevious step by an etching, forming a buried layer by a metal organicvapor phase epitaxy (MOVPE) using the remaining dielectric layer as amask so that the buried layer is formed on the substrate excluding thetop surface of the stripe of the first mesa and the sloping surface ofthe stripe of the first mesa is covered a sloping surface part of theburied layer, where this step is carried out under conditions such thatthe growth rate of the buried layer on the sloping surface of the stripeof the first mesa is slower than that at other parts of the substrate,the top surface of the stripe of the first mesa forms a stripe of asecond mesa together with the sloping surface of the buried layer andthe stripe of the second mesa has a smaller inclination than the stripeof the first mesa, removing the dielectric layer by an etching, andforming a double heterostructure made up of a plurality of semiconductorlayers on the stripe of the second mesa by a metal organic vapor phaseepitaxy (MOVPE).

Another object of the present invention is to provide a method ofproducing a semiconductor laser comprising the steps of forming on asubstrate a mask having a stripe opening which extends in a <110>direction of the substrate, where the substrate is made of a compoundsemiconductor of a first conductor type, forming a stripe projectionpart on the substrate which is exposed within the stripe opening by ametal organic vapor phase epitaxy (MOVPE), where the stripe projectionpart has one of a triangular and a trapezoidal cross section with a(111)B face as its sloping surface and being made of a compoundsemiconductor, forming a blocking layer on the substrate by a metalorganic vapor phase epitaxy (MOVPE) so as to cover the (111)B face undera predetermined condition such that a growth rate of the blocking layeron the sloping surface of the stripe projection part is slower than thatat other parts of the substrate, and forming a stripe part which acts asa wave guide and a bent part provided on both sides of the stripe partfor trapping light by successively growing a first cladding layer, anactive layer and a second cladding layer, the stripe part being formedabove the stripe projection part, where the bent part has a (311)B faceas its sloping surface and the first and second cladding layers arerespectively made of mutually opposite first and second conductor types.According to the method of the present invention, the stripe projectionpart which becomes the base for forming the stripe part which acts asthe waveguide and the bent parts which trap the light is not formed byan etching. Instead, the stripe projection part is grown on a substratehaving a satisfactory crystal orientation. Hence, the semiconductorlayers formed on such a substrate will not include crystal defects, andit becomes possible to realize a semiconductor laser having a highperformance free of abberation loss or the like.

Other objects and further features of the present invention will beapparent from the following detailed description when read inconjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view showing an essential part of aconventional semiconductor laser having the ridge type structure;

FIG. 2 is a cross sectional view showing an essential part of aconventional semiconductor laser having the buried type structure;

FIG. 3 is a cross sectional view showing an essential part of aconventional semiconductor laser having the shaped substrate structure;

FIG. 4 is a cross sectional view showing an essential part of theconventional semiconductor laser having the shaped substrate structurefor explaining a production method using etching;

FIG. 5 is a cross sectional view showing an essential part of theconventional semiconductor laser having the shaped substrate structurefor explaining a production method using selective growth;

FIG. 6 is a cross sectional view showing an essential part of theconventional semiconductor laser having the shaped substrate structurefor explaining a production method using selective growth;

FIG. 7 is a cross sectional view showing an essential part of theconventional semiconductor laser when a semiconductor layer is grown ona shaped substrate which has a conventional mesa extending in the <110 >direction formed by the etching;

FIG. 8 is a cross sectional view showing an essential part of theconventional semiconductor laser when a semiconductor layer is grown ona shaped substrate which has a conventional mesa extending in the <110>direction formed by the etching;

FIG. 9 is a cross sectional view showing an essential part of a knownGaAs/AlGaAs system semiconductor laser which has a shaped substrate witha gradual sloping surface;

FIG. 10 is a cross sectional view showing an essential part of asemiconductor laser proposed in a Japanese Laid-Open Patent ApplicationNo.55-158689;

FIG. 11 is a cross sectional view showing an essential part of asemiconductor laser proposed in a Japanese Laid-Open Patent ApplicationNo.64-30287;

FIG. 12 is a plan view showing an essential part of a GaAs substratewhich is used to form a shaped substrate;

FIG. 13 is a cross sectional view of an essential part of a sample forexplaining a mesa stripe which is formed in the <110> direction usingvarious etchants;

FIG. 14 is a cross sectional view of an essential part of a sample forexplaining a groove which is formed in the <110> direction under thesame conditions and by use of the same etchants as in FIG. 13;

FIG. 15 is a cross sectional view of an essential part of a sample forexplaining a conventional mesa having a sloping surface which issubstantially the (111)B face;

FIG. 16 is a cross sectional view of an essential part of a sample forexplaining a case where a GaAs layer is grown on a GaAs substrate 71having mesas A and 71B;

FIG. 17 is a cross sectional view of an essential part of a sample forexplaining a case where a SiO₂ layer formed by a sputtering is used;

FIG. 18 is a cross sectional view of an essential part of a sample forexplaining a case where a semiconductor layer is grown using a shapedsubstrate shown in FIG. 17;

FIG. 19 is a cross sectional view of an essential part of a sample forexplaining a case where a thick GaAs layer is formed;

FIG. 20 is a cross sectional view of an essential part of a sample forexplaining a state where eaves of the SiO₂ mask is removed;

FIG. 21 is a cross sectional view of an essential part of a sample forexplaining a state where a GaAs layer is grown on a shaped substrateshown in FIG. 20;

FIG. 22 is a cross sectional view of an essential part of a sample forexplaining a state where a GaAs substrate is etched by an RIE;

FIG. 23 is a cross sectional view of an essential part of a sample forexplaining a state where an etching is made by use of an etchant havingapproximately the same etching rates for the mask and the semiconductor;

FIG. 24 is a photo which is taken by an electron microscope andcorresponds to an essential part of a semiconductor laser in a vicinityof a mesa for explaining the removal of the eaves of the mask;

FIG. 25 is a photo which is taken by an electron microscope andcorresponds to an essential part of a semiconductor laser in a vicinityof a mesa for explaining the removal of the eaves of the mask;

FIG. 26 is a cross sectional view showing an essential part of a firstembodiment of a semiconductor laser according to the present invention;

FIGS. 27 through 33 are cross sectional views showing the firstembodiment of the semiconductor laser at various production stages forexplaining a first embodiment of a method of producing the semiconductorlaser according to the present invention;

FIG. 34 is a cross sectional view showing an essential part of a secondembodiment of the semiconductor laser according to the presentinvention;

FIG. 35 is a cross sectional view showing an essential part of a thirdembodiment of the semiconductor laser according to the presentinvention;

FIG. 36 is a cross sectional view showing an essential part of a fourthembodiment of the semiconductor laser according to the presentinvention;

FIG. 37 is a cross sectional view showing an essential part of a fifthembodiment of the semiconductor laser according to the presentinvention;

FIG. 38 is a diagram for explaining a stacked structure at an essentialpart of the semiconductor laser shown in FIG. 37 in correspondence withthe laser field intensity distribution;

FIG. 39 shows an energy band diagram for explaining the problem of aheterostructure made up of GaAs and AlGaInP;

FIG. 40 shows an energy band diagram for explaining a means for reducingthe problem of the heterostructure made up of GaAs and AlGaInP;

FIG. 41 is a cross sectional view showing an essential part of asemiconductor laser for explaining the generation of electron-hole pairswithin an n-type GaAs buried layer;

FIG. 42 shows an energy band diagram taken along a line Y--Y in FIG. 41;

FIG. 43 shows an energy band diagram for explaining the reduction of apotential barrier with respect to the holes in the n-type GaAs buriedlayer;

FIG. 44 is a cross sectional view showing an essential part of a sixthembodiment of the semiconductor laser according to the presentinvention;

FIG. 45 shows an energy band diagram of the semiconductor laser shown inFIG. 44;

FIG. 46 is a cross sectional view showing an essential part of asemiconductor laser for explaining a known technique related to thesixth embodiment of the semiconductor laser;

FIG. 47 is a cross sectional view showing an essential part of asemiconductor laser having an AlGaAs or AlGaInP buried layer;

FIG. 48 is a cross sectional view showing an essential part of a seventhembodiment of the semiconductor laser according to the presentinvention;

FIG. 49 shows an energy band diagram taken along a line Y--Y in FIG. 48;

FIG. 50 shows an energy band diagram for explaining a case where theseventh embodiment of the semiconductor laser operates as a phototransistor;

FIG. 51 shows an energy band diagram for explaining an eighth embodimentof the semiconductor laser according to the present invention;

FIG. 52 shows an energy band diagram for explaining a ninth embodimentof the semiconductor laser according to the present invention;

FIG. 53 is a perspective view showing an essential part of asemiconductor laser having a stripe width which is small only in avicinity of a laser edge facet;

FIG. 54 is a cross sectional view showing essential parts of thesemiconductor laser taken along lines c--c' and d--d', in FIG. 53;

FIGS. 55 through 58 are perspective views showing a tenth embodiment ofthe semiconductor laser according to the present invention at variousproduction stages for explaining a second embodiment of the method ofproducing the semiconductor laser according to the present invention;

FIG. 59 is a plan view showing an essential part of the tenth embodimentof the semiconductor laser;

FIG. 60 is a plan view showing an essential part of a modification ofthe tenth embodiment of the semiconductor laser according to the presentinvention;

FIGS. 61 through 65 are perspective views showing an eleventh embodimentof the semiconductor laser according to the present invention at variousproduction stages for explaining a third embodiment of the method ofproducing the semiconductor laser according to the present invention;

FIG. 66 is a cross sectional view showing essential parts of thesemiconductor laser taken along lines a1--a1' and b1--b1' in FIG. 61;

FIG. 67 is a cross sectional view showing essential parts of thesemiconductor laser taken along lines a2--a2' and b2--b2' in FIG. 63;

FIG. 68 is a cross sectional view showing an essential part of thesemiconductor laser taken along a line a3--a3' in FIG. 65;

FIG. 69 is a cross sectional view showing an essential part of thesemiconductor laser taken along a line b3--b3' in FIG. 65;

FIG. 70 is a cross sectional view showing an essential part of amodification of the eleventh embodiment of the semiconductor laser takenalong the line a3--a3' in FIG. 65;

FIG. 71 is a cross sectional view showing essential parts of asemiconductor laser at various production stages of a fourth embodimentof the method of producing the semiconductor laser according to thepresent invention;

FIGS. 72 through 76 are cross sectional views showing an essential partof a semiconductor laser at various production stages for explaining afifth embodiment of the method of producing the semiconductor laseraccording to the present invention;

FIG. 77 is a photo which is taken by an electron microscope andcorresponds to an essential part of the semiconductor laser which isproduced by the fifth embodiment of the method;

FIG. 78 is a cross sectional view for explaining double heterostructureswhich are formed at growth temperatures of 690° C. and 730° C.;

FIGS. 79 through 85 are cross sectional views showing an essential partof a semiconductor laser at various production stages for explaining asixth embodiment of the method of producing the semiconductor laseraccording to the present invention;

FIG. 86 is a perspective view showing an essential part of asemiconductor laser at a production stage for explaining the principleof a seventh embodiment of the method of producing the semiconductorlaser according to the present invention;

FIGS. 87 and 88 are cross sectional views showing an essential part ofthe semiconductor laser at various production stages for explainingprinciple of the seventh embodiment of the method of producing thesemiconductor laser according to the present invention;

FIG. 89 is a perspective view showing an essential part of thesemiconductor laser at a production stage for explaining the seventhembodiment of the method of producing the semiconductor laser accordingto the present invention;

FIGS. 90 through 92 are cross sectional views showing an essential partof the semiconductor laser at various production stages for explainingthe seventh embodiment of the method of producing the semiconductorlaser according to the present invention;

FIG. 93 is a perspective view showing an essential part of asemiconductor laser at a production stage for explaining an eighthembodiment of the method of producing the semiconductor laser accordingto the present invention;

FIGS. 94 through 101 are cross sectional views showing an essential partof the semiconductor laser at various production stages for explainingthe eighth embodiment of the method of producing the semiconductor laseraccording to the present invention; and

FIG. 102 is a cross sectional view showing an essential part of asemiconductor laser which is produced by a ninth embodiment of themethod of producing the semiconductor laser according to the presentinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

According to one aspect of the present invention, a sloping surface partrequired to bend an active layer and a part which operates as a laserare formed independently so that the stripe width and the thickness of acladding layer can be controlled independently. This approach iseffective particularly in the case of the AlGaInP system semiconductorlaser in which the thermal resistance of the cladding layer is large.

In the semiconductor laser according to the present invention, thesloping surface of a mesa stripe which extends in the <110> directionmust be the (111)B face in order to ensure growth of a smooth buriedlayer as described above. Hence, the present inventors have experimentedusing various etchants to form such a mesa stripe, but it was difficultto find an etchant which exposes the (111)B face. Extensive trial anderror were necessary to find a suitable etchant.

A description will be given of main examples of the experiments relatedto the etching conducted by the present inventors.

FIG. 12 is a plan view showing an essential part of a GaAs substratewhich is used for the experiment to form a shaped substrate. A GaAssubstrate 71 has a main surface which is the index of crystal surface(100) The <110> direction is perpendicular to the facet edge, and the<110 > is parallel to the facet edge. When a NH₃ system etching solutionis used on this GaAs substrate 71, a re-entrant mesa is formed in the<110> direction and a conventional mesa is formed in the <110>direction.

The etching solutions used are follows.

(a) NH₄ OH:H₂ O₂ :H₂ O

(b) H₃ PO₄ :H₂ O₂ :H₂ O

(c) Br/CH₃ COOH:H₃ PO₄

FIG. 13 (A), (B) and (C) respectively show an essential part of a samplefor explaining the formation of a mesa stripe in the <110> using theetching solutions (a), (b) and (c). In FIG. 13, the same designationsare used as in FIG. 12. A stripe SiO₂ layer 72 extends in the <110>direction. FIG. 13 (A) shows a state where the etching is made using theetching solution (a) at an etching speed of 2.5 μm/min, and the slopingsurface of the re-entrant mesa is estimated to be the (221)A face. FIG.13 (B) shows a state where the etching is made using the etchingsolution (b) at an etching speed of 2.5 μmin. In this case, a smallconventional mesa is formed at the bottom part, and the sloping surfaceof this small conventional mesa is estimated to be the (111)B face. FIG.13 (C) shows a state where the etching is made using the etchingsolution (c) at an etching speed of 0.4 μm/min. In this case, thesloping surface of the conventional mesa is rounded and is estimated tobe the (011) face.

FIG. 14 (A), (B) and (C) respectively show an essential part of a samplefor explaining the formation of a groove in the <110> using the etchingsolutions (a), (b) and (c). In FIG. 14, the same designations are usedas in FIG. 13. The SiO₂ layer 72 itself in this case does not have thestripe shape but has a stripe opening which extends in the <110>direction.

As described above, various experiments were conducted to expose the(111)B face, and the present inventors were finally able to find asuitable etchant and an etching mask which can be used in common for theselective growth.

In other words, a SiO₂ layer which is formed by a thermal chemical vapordeposition (CVD) is used as the mask, and the mixed solution made up ofH₂ SO₄ :H₂ O₂ :H₂ O is heated to approximately 35° C. or higher and usedas the etchant. By this combination, it was confirmed that aconventional mesa having the (111)B face exposed at a large part of thesloping surface can be formed although a slight re-entrant mesa appears.The slight re-entrant mesa is generated extremely close to the SiO₂layer which is used as the mask. During the actual process, the etchantwas heated to approximately 50° C. for the purpose of reducing thedamage on the etching surface.

FIG. 15 shows an essential part of a sample for explaining aconventional mesa having the sloping surface which is substantially the(111)B face. In FIG. 15, the same designations are used as in FIGS. 12through 14. In FIG. 15, the substrate 71 has a conventional mesa 71A anda re-entrant mesa which is formed extremely close to the SiO₂ layer 72.As shown, a large part of the mesa structure is the conventional mesa71A having the sloping surface which is substantially the (111)B face.

When experiments were conducted to grow a semiconductor layer on theshape substrate described above, a problem was encountered in that thesemiconductor layer had the tendency of not growing on the substrate 71above a bent part which corresponds to the boundary of the conventionalmesa 71A and the re-entrant mesa 71B.

FIG. 16 shows an essential part of a sample for explaining the growth ofa GaAs layer on the GaAs substrate 71 having the mesas 71A and 71B. InFIG. 16, the same designations as used as in FIGS. 12 through 15. Asshown, a GaAs layer 73 does not grow above the boundary of theconventional mesa 71A and the re-entrant mesa 71B. However, when theSiO₂ layer 72 which is used in common as the mask for selective growthand the etching mask was formed by a sputtering, the re-entrant mesa 71Bcompletely eliminated.

It was possible to eliminate the re-entrant mesa 71B for the followingreasons. That is, compared to the SiO₂ layer which is formed by thethermal CVD, the SiO₂ layer which is formed by the sputtering has apoorer adherence to GaAs, and thus, the etching rate at the boundaryincreased in the transverse direction.

FIG. 17 shows an essential part of a sample for explaining a case wherethe SiO₂ layer used is formed by the sputtering. In FIG. 17, the samedesignations as used as in FIGS. 12 through 16. A SiO₂ layer 72' shownis formed by the sputtering. As may be seen from FIG. 17, the re-entrantmesa is completely eliminated, and the mesa structure is solely made upof the conventional mesa 71A.

When the semiconductor layer is grown on the shaped substrate shown inFIG. 17, the semiconductor layer positively grows to immediately underthe SiO₂ layer 72'.

FIG. 18 shows an essential part of a sample for explaining a case wherea semiconductor layer is grown on the shaped substrate shown in FIG. 17.In FIG. 18, the same designations are used as in FIGS. 12 through 17. Asshown, a GaAs layer 73' is grown in this case, and the growth of thisGaAs layer 73' extends to immediately the SiO₂ layer 72'. However, whenthe growth of the GaAs layer 73' is continued until the GaAs layer 73'becomes thick, the growth rate under the eaves of the SiO₂ layer 72'slows down and a problem occurred in that a depression is formed asshown in FIG. 19.

FIG. 19 shows an essential part of a sample for explaining a case wherea thick GaAs layer 73' is grown. In FIG. 19, the same designations areused as in FIGS. 12 through 18. As described above, a depression 74 isformed under the eaves of the SiO₂ layer 72' when the thick GaAs layer73' is grown.

In order to solve this problem of the formation of the undesirabledepression 74, it was found effective to remove the eaves of the SiO₂layer 72' by a length which will not deteriorate with the shape of thelayer which is to be formed thereafter. When the mesa structure has aheight which is generally required, that is, a height of 2 μm, forexample, the eaves of the SiO₂ layer 72' project by approximately 1.6μm.

Normally, a hydrofluoric acid buffer solution (a mixed solution ofHF:NH₄ F and hereinafter simply referred to as BHF) may be used as theetchant when removing the eaves of the SiO₂ layer 72'. When the etchingis made for a time required to etch approximately half the thickness ofthe SiO₂ layer 72', the eaves is removed in its entirety because theeaves is etched from the top and bottom surfaces thereof. As a result,the SiO₂ layer 72' having approximately half the original thicknessremains at the part where the SiO₂ layer 72' makes contact with theshaped substrate.

But when the structure is observed after the eaves of the SiO₂ layer 72'is removed by the above described manner, it was found that the GaAssurface is exposed at the top surface of the mesa structure at the partcorresponding to the edge of the SiO₂ layer 72' which is used as themask.

FIG. 20 shows an essential part of a sample for explaining a state wherethe eaves of the SiO₂ layer is removed. In FIG. 20, the samedesignations are used as in FIGS. 12 through 19. As shown in FIG. 20, atop surface part 71C of the conventional mesa 71A is exposed at the edgeof the SiO₂ layer 72' after the eaves of the SiO₂ layer 72' is removed.When a semiconductor layer is grown on the shaped substrate shown inFIG. 20, the semiconductor layer also grows on the top surface part 71Cin a horn shape.

FIG. 21 shows an essential part of a sample for explaining a state wherea GaAs layer is grown on the shaped substrate shown in FIG. 20. In FIG.21, the same designations are used as in FIGS. 12 through 20. When aGaAs layer 75 is grown, a horn shaped part 75A which connects to theGaAs layer 75 is formed on the top surface part 71C of the conventionalmesa 71A.

When the AlGaInP system double heterostructure is formed above the mesastructure having the horn shaped part 75A, the active layer of thedouble heterostructure will include fine irregularities reflecting thehorn shaped part 75A. As a result, the transverse mode of the laser beamwhich oscillates with the active layer having such irregularitiesbecomes a high-order mode even when the stripe width is such that thesingle mode osillation would occur if the active layer is flat.

Accordingly, it is necessary to match the edge of the SiO₂ layer 72' andthe edge at the top surface of the conventional mesa 71A or eaves mustbe 0.3 μm or less so as not to interfere with the growth of the buriedlayer. If it is sufficient to simply match the edge of the SiO₂ layer72' and the edge at the top surface of the conventional mesa 71A, theGaAs substrate 71 including the conventional mesa 71A may be etched bythe RIE. However, the sloping surface of the conventional mesa 71A wouldbecome almost vertical when the RIE is used.

FIG. 22 shows an essential part of a sample for explaining a state wherethe GaAs substrate 71 is etched using the RIE. In FIG. 22, the samedesignations are use as in FIGS. 12 through 21. As shown in FIG. 22, asloping surface 71D of the mesa structure which is formed by the RIE isalmost vertical. In addition, damages 76 are generated at the surfacepart of the substrate 71 due to the RIE.

The sloping surface 71D is not the (111)B face which is required, andthe (110) face appears as a singular face. Hence, it is impossible tosatisfactorily form a semiconductor layer on the shaped substrate shownin FIG. 22. Furthermore, the crystal properties of the semiconductorlayer which is grown on such a shaped substrate is poor because of thedamages 76.

In order to solve this problem, the present invention uses an etchantwhich etches both the mask and the semiconductor when etching the eavesof the mask so that the edge at the top surface of the conventional mesa71A matches the edge of the eaves of the mask. In this case, asatisfactory etching shape is obtainable when the etchant used hasapproximately the same etching rate for the mask and the semiconductor.

FIG. 23 shows an essential part of a sample for explaining a state wherean etching is made using an etchant which has approximately the sameetching rate for the mask and the semiconductor. In FIG. 23, the samedesignations are used as in FIGS. 12 through 22. A reference numeral 77in FIG. 23 indicates a vicinity of an edge of the SiO₂ layer 72' and anedge at the top surface of the conventional mesa 71A. The eaves of theSiO₂ layer 72' is removed by use of an etching solution having BHF+H₂ Oas the main composition.

FIGS. 24 and 25 are photos taken by an electron microscope forexplaining a state where the eaves of the mask is removed. The mesastructure was formed by first forming a conventional mesa correspondingto the conventional mesa 71A using a H₂ O₄ :H₂ O₂ :H₂ O system etchant,and thereafter removing the eaves of the mask corresponding to the SiO₂layer 72' using a mixed solution of BHF:H₂ O₂ :H₂ SO₄ as the etchant.

FIG. 24 shows a case where the etching rate of the mask (SiO₂ layer) isgreater than that of the GaAs substrate. As shown, the resulting shapeis similar to the case where only BHF is used as the etchant.

FIG. 25 shows a case where the etching rates of the mask (SiO₂ layer)and the GaAs substrate are approximately the same. As shown, theresulting shape does not show any disorder at the sloping surface of theconventional mesa. It was thus confirmed that a satisfactory growth ofthe semiconductor layer is possible without generating the horn shapedpart at the top edge part of the conventional mesa.

The mixed solution of H₂ SO₄, H₂ O₂ and HF/NH₄ F (BHF) is suited for useas the etchant when removing the eaves of the mask (SiO₂ layer).

When the shaped substrate is formed in the above described manner, it ispossible to grow various semiconductor layers made of the AlGaInP systemmaterial which make lattice matching with GaAs. Hence, it becomespossible to realize a semiconductor laser having satisfactorycharacteristics.

As shown in FIG. 25, for example, the edge of the mask (SiO₂ layer) istapered in an opposite direction to the conventional mesa. However, thepart of the mask which projects from the vertical surface is only in theorder of 500 Å and will not cause the problems encountered in the caseof the eaves of the mask.

Therefore, according to the present invention, it is possible to makethe stripe width for making the single transverse mode control wide evenwhen the lower cladding layer for obtaining a bent active layer is madethin, using a simple process.

Hence, even when the cladding layer on the lower side of the activelayer is made thin to improve the heat release, the stripe width can bemade sufficiently wide because the sloping surface of the shapedsubstrate is gradual, where the shaped substrate is made up of theconventional mesa formed on the substrate and the buried layer whichcover the sloping surface of the conventional mesa. In addition, thebend in the active layer becomes gradual, and a satisfactory singletransverse mode control can be made because the difference in theindexes of diffraction sensed by the guided light is small. The presentinvention is suited for the production of the AlGaInP systemsemiconductor using the MOVPE.

Next, a description will be given of a first embodiment of thesemiconductor laser according to the present invention, by referring toFIG. 26. The semiconductor laser shown in FIG. 26 includes an n-typeGaAs substrate 81, a mesa 81A, an n-type GaAs buried layer 82, an n-typeAlGaInP cladding layer 83, an InGaP active layer 84, a p-type AlGaInPcladding layer 85, a p-type InGaP buffer layer 86, a p-type GaAs contactlayer 87, a SiO₂ insulator layer 88, a p side electrode 89 and an n sideelectrode 90.

Next, a description will be given of a first embodiment of a method ofproducing the semiconductor laser according to the present invention, byreferring to FIGS. 27 through 33. In FIGS. 27 through 33, those partswhich are the same as those corresponding parts in FIG. 26 aredesignated by the same reference numerals. This first embodiment of themethod produces the first embodiment of the semiconductor laser shown inFIG. 26.

As shown in FIG. 27, a SiO₂ layer 91 is formed on the n-type GaAssubstrate 81 to a thickness of 200 nm, for example, by a sputtering. Themain surface of the n-type GaAs substrate 81 used is the (100) face, andthe n-type GaAs substrate 81 has an impurity concentration of 1×10¹⁹cm⁻³. A resist process of a photolithography technique and a wet etchingusing HF/NH₄ F as the etchant are used to pattern the SiO₂ layer 91 soas to form a stripe of the SiO₂ layer 91 having a width of 6 μm andextending in the <110> direction.

Then, as shown in FIG. 28, a mesa etching of the n-type GaAs substrate81 is made using the stripe of the SiO₂ layer 91 as a mask and anetchant H₂ SO₄ +H₂ O₂ +H₂ O for a wet etching. As a result, a mesa 81Ahaving a height of approximately 2 μm is formed.

In FIG. 29, a wet etching using an etchant H₂ SO₄ +H₂ O₂ +BHF is made toremove eaves of the SiO₂ layer 91.

In FIG. 30, the n-type GaAs buried layer 82 is grown using a MOVPE. Then-type GaAs buried layer 82 has a thickness of 1 μm, for example, and animpurity concentration of 3×10¹⁸ cm⁻³, for example. In this case, sincethe eaves of the SiO₂ layer 91 is already removed, the shape of thegrown n-type GaAs buried layer 82 is satisfactory. A similar shape canbe formed using Al₀.1 Ga₀.9 As in place of GaAs for the buried layer 82.

Thereafter, the SiO₂ layer 91 is removed by submersion into a HF etchantas shown in FIG. 31.

As shown in FIG. 31, the n-type AlGaInP cladding layer 83, the InGaPactive layer 84, the p-type AlGaInP cladding layer 85, the p-type InGaPbuffer layer 86 and the p-type GaAs contact layer 87 are successivelyformed by an MOVPE. In this embodiment, the thickness and the like ofeach layer are as follows.

Cladding layer 83

Thickness: 0.8 μm

Impurity: Si

Impurity concentration: 4×10¹⁷ cm⁻³

Active layer 84

Thickness: 70 nm

Cladding layer 85

Thickness: 1.0 μm

Impurity: Zn

Impurity concentration: 3×10¹⁷ cm⁻³

Buffer layer 86

Thickness: 100 nm

Impurity: Zn

Impurity concentration: 1×10¹⁸ cm⁻³

Contact layer 87

Thickness: 2 μm

Impurity: Zn

Impurity concentration: 3×10.sup.˜ cm⁻³

As shown in FIG. 33, the insulator layer 88 made of SiO₂ and having athickness of 200 nm, for example, is formed on the contact layer 87 by aCVD. Then, the insulator layer 88 is etched to form a stripe openingusing a resist process of a photolithography technique and a wet etchingwhich uses a hydrofluoric acid buffer solution as the etchant.

A vacuum deposition is used to form on the contact layer 87 the p sideelectrode 89 which has a thickness of 4000 Å in total and is made up ofstacked layers of Ti, Pt and Au. The Ti, Pt and Au layers respectivelyhave thicknesses of 1000 Å, 1000 Å and 2000 Å.

Similarly, a vacuum deposition is used to form on the substrate 81 the nside electrode 90 which has a thickness of 3000 Å in total and is madeup of stacked layers of AuGe and Au. The AuGe and Au layers respectivelyhave thicknesses of 500 Å and 2500 Å. The n-type GaAs substrate 81 maybe polished to reduce the thickness of the n-type GaAs substrate 81prior to forming the n side electrode 90.

In the semiconductor laser which is completed in the above describedmanner, the stripe width for making the single transverse mode controlcan be set sufficiently wide. Moreover, the thermal resistance is lowbecause the cladding layer 83 is thin.

Next, a description will be given of a second embodiment of thesemiconductor laser according to the present invention, by referring toFIG. 34. In FIG. 34, those parts which are the same as thosecorresponding parts in FIGS. 26 through 33 are designated by the samereference numerals, and a description thereof will be omitted. In FIG.34, a p-type GaAs buried layer 92 is provided.

According to the structure of this embodiment, the p-type GaAs buriedlayer 92 acts as a current confinement layer and it becomes possible toomit the insulator layer 88 shown in FIG. 33. When no insulator layer 88is required, the heat release can be made satisfactorily because of thereduced thermal resistance, even when the p side of the structure ismounted on a heat sink. The p-type GaAs used for the buried layer 92 maybe replaced by a Cr doped semiinsulative GaAs.

In the AlGaInP system materials, the resistivities of the Zn dopedp-type AlGaInP and the Mg doped p-type AlGaInP respectively are 1 and0.2 Ωcm and large. On the other hand, the resistivity of the Si dopedp-type AlGaInP can be reduced down to 0.05 Ωcm. From the point of viewof reducing the ohmic loss of the semiconductor laser as a whole, it isdesirable that the resistance is a small as possible. But from the pointof view of deciding whether the current confinement layer is to beprovided on the front or back side of the substrate, it is possible toreduce the current spread within the cladding layer after the currentconfinement and accordingly reduce the invalid current when theresistance is large. Accordingly, it is desirable in the case of theAlGaInP system semiconductor laser to use a p-type GaAs substrate andmake the current confinement on the p side.

Next, a description will be given of a third embodiment of thesemiconductor laser according to the present invention in which a p-typeGaAs substrate is used and the current confinement is made on the pside. As shown in FIG. 35, this third embodiment of the semiconductorlaser includes a p-type GaAs substrate 101, an n-type GaAs buried layer102, a p-type InGaP buffer layer 103, a p-type AlGaInP cladding layer104, an InGaP active layer 105, an n-type AlGaInP cladding layer 106, ann-type GaAs contact layer 107, an n side electrode 108 and a p sideelectrode 109. In this embodiment, the thickness and the like of eachlayer are as follows.

Substrate 101

Impurity: Zn

Impurity concentration: 1×10.sup.˜ cm⁻³

Buried layer 102

Thickness: 1 μm

Impurity: Si

Impurity concentration 3×10¹⁸ cm⁻³

Buffer layer 103

Thickness: 0.1 μm

Impurity: Zn

Impurity concentration: 1×10.sup.˜ cm⁻³

Cladding layer 104

Thickness: 0.8 nm

Impurity: Zn

Impurity concentration: 1×10.sup.∫ cm⁻³

Active layer 105

Thickness: 70 nm

Cladding layer 106

Thickness: 1 μm

Impurity: Si

Impurity concentration: 4×10¹⁷ cm⁻³

Contact layer 107

Thickness: 1 nm

Impurity: Si

Impurity concentration: 1×10¹⁸ cm⁻³

n side electrode 108

Material: Au/AuGe (GaAs side)

Thickness: 2500 Å/500 Å

p side electrode 109

Material: Au/Zn/Au (GaAs side)

Thickness: 2340 Å/360 Å/300 Å

Next, a description will be given of a fourth embodiment of thesemiconductor laser according to the present invention, by referring toFIG. 36. In FIG. 36, those parts which are the same as thosecorresponding parts in FIG. 35 are designated by the same referencenumerals, and a description thereof will be omitted.

This embodiment differs from the third embodiment shown in FIG. 35 inthat after the n-type GaAs buried layer 102 is formed, a p-type GaAsbuffer layer is formed prior to forming the p-type InGaP buffer layer103. For example, the p-type GaAs buffer layer 110 has a thickness ofapproximately 300 Å and an impurity concentration of 3×10¹⁸ cm⁻³.According to this embodiment, it is possible to improve the morphologyof the layers which are formed above the p-type GaAs buffer layer 110.

Generally, when the structure is designed to reduce a light fieldconfinement factor Γ by making the light distribution with respect tothe active layer asymmetrical and to improve the COD level, theasymmetrical light distribution is generated in most cases by reducingthe Al content of the cladding layer which is adjacent to the activelayer. However, in the case of the AlGaInP system semiconductor laser,the band discontinuity between the InGaP active layer and the AlGaInPcladding layer in the conduction band is only in the order of 190 meV.For this reason, it is undesirable to reduce the band discontinuity inthe conduction band by reducing the Al content of the p side claddinglayer which acts as a barrier for the electrons in the doubleheterostructure. Accordingly, the reduction of the Al content toincrease the evanescent distribution of light is limited to the n side.

Next, a description will be given of a fifth embodiment of thesemiconductor laser according to the present invention, by referring toFIG. 37. In this embodiment, the evanescent distribution of light in then side cladding layer is made large. The semiconductor laser shown inFIG. 37 includes a p-type GaAs substrate 111, an n-type GaAs buriedlayer 112, a p-type GaAs buffer layer 113, a p-type InGaP buffer layer114, a p-type AlInP cladding layer 115, an InGaP active layer 116, ann-type (Al₀.5 Ga₀.5)₀.5 In₀.5 P cladding (guide) layer 117, an n-typeAlInP cladding layer 118, an n-type GaAs contact layer 119, an n sideelectrode and a p side electrode 121. In this embodiment, the thicknessand the like of each layer are as follows.

Substrate 111

Impurity: Zn

Impurity concentration: 1×10.sup.· cm⁻³

Buried layer 112

Thickness: 1 μm

Impurity: Si

Impurity concentration 3×10¹⁸ cm⁻³

Buffer layer 113

Thickness: 300 Å

Impurity: Zn

Impurity concentration: 1×10¹⁸ cm⁻³

Buffer layer 114

Thickness: 0.1 μm

Impurity: Zn

Impurity concentration: 1×10.sup.˜ cm⁻³

Cladding layer 115

Thickness: 0.4 μm

Impurity: Zn

Impurity concentration: 2×10¹⁷ cm⁻³

Active layer 116

Thickness: 0.07 μm

Cladding layer 117

Thickness: 0.5 μm

Impurity: Si

Impurity concentration: 4×10¹⁷ cm⁻³

Cladding layer 118

Thickness: 0.4 μm

Impurity: Si

Impurity concentration: 4×10¹⁷ cm⁻³

Contact layer 119

Thickness: 1 μm

Impurity: Si

Impurity concentration: 1×10¹⁸ cm⁻³

n side electrode 120

Material: Au/AuGe (GaAs side)

Thickness: 2500 Å/500 Å

p side electrode 121

Material: Au/Zn/Au (GaAs side)

Thickness: 2340 Å/360 Å/300 Å

In this embodiment, the evanescent distribution of light is increased byproviding the n-type Al₀.5 Ga₀.5)₀.5 In₀.5 P cladding layer 117 as theguide layer on the n side. At the same time, the D.C. resistance as awhole is reduced and it is possible to effectively suppress thetemperature rise because the p-type AlInP cladding layer 115 having thelarge resistance can be made thin. According to the experimentsconducted by the present inventors, it was found that the lightabsorption by the p-type GaAs substrate 111 or the p-type InGaP bufferlayer 114 is light and the loss can be suppressed to a small value evenwhen the thickness of the p-type AlInP cladding layer 115 is reduced to0.4 μm. Moreover, it was also confirmed that the thermal resistance iseffectively reduced because the p-type AlInP cladding layer 115 is thinand the InGaP active layer 117 is close to the n-type GaAs substrate111.

FIG. 38 is a diagram for explaining an essential part of the stackedstructure of the semiconductor laser shown in FIG. 37 in correspondencewith a laser beam distribution. In FIG. 38, the same designations areused as in FIG. 37.

FIG. 38 (A) shows an essential part of the embodiment shown in FIG. 37,and FIG. 38 (B) shows a corresponding laser field distribution, wherethe abscissa indicates the light intensity.

As may be seen from FIG. 38, the evanescent distribution of light in theside of the p-type AlInP cladding layer 115 is small, while theevanescent distribution of light in the side of the n-type AlGaInPcladding layer 117 is large.

In the embodiments described in conjunction with FIGS. 36 and 37, thep-type InGaP buffer layer 104 (or p-type InGaP buffer layer 114) isinterposed between the p-type GaAs buffer layer 110 (or 113) and thep-type AlGaInP cladding layer 104 (or p-type AlInP cladding layer 115).This structure is taken because of the special circumstances introducedby the use of the AlGaInP system material.

In other words, in the heterostructure made up of GaAs and AlGaInP, theenergy band discontinuity at the peak of the valence band reaches 0.6 eVat the maximum. Thus, when the p-type GaAs layer and the p-type AlGaInPlayer are stacked adjacent to each other, a current will not flow unlessa large voltage is applied.

FIG. 39 shows an energy band diagram for explaining the heterostructuremade up of GaAs and (Al_(x) Ga_(1-x))₀.5 In₀.5 P (x=0.7). In FIG. 39,E_(v) denotes the peak of the valence band, E_(c) denotes a bottom ofthe conduction band, ΔE_(v) denotes a discontinuity value at the peak ofthe valence band, ΔE_(c) denotes a discontinuity value at the bottom ofthe conduction band, and h denotes holes. As described above, ΔE_(v) is0.52 V and ΔE_(c) is 0.38 V.

Accordingly, the holes h will not flow from the p-type GaAs layer to thep-type AlGaInP layer by exceeding the discontinuity value ΔE_(v) unlessthe operating voltage is set large. Of course, there is no electriccurrent when there is no flow of the holes h.

When the above described heterostructure is employed in thesemiconductor laser, a large voltage must be applied to thesemiconductor laser and the power consumption as a whole becomes large.The AlGaInP system semiconductor laser already suffers from the largethermal resistance described above, and it is of course undesirable toincrease the power consumption.

The above described problem of the large power consumption may bereduced by providing a layer which is made of a material having anintermediate energy band gap between those of the GaAs and AlGaInP.Particularly, it is known to provide a buffer layer made of p-type InGaPor AlGaInP, for example, so as to confine the current using thecharacteristic of the buffer layer. For example, a semiconductor laserapplied with such a current confinement structure is proposed inJapanese Laid-Open Patent Applications No.62-200784 and No.63-81884.

FIG. 40 shows an energy band diagram for explaining a means for reducingthe above described problem of the heterostructure which is made up ofthe GaAs and AlGaInP. In FIG. 40, the same designations are used as inFIG. 39.

As may be seen from FIG. 40, the discontinuity value ΔE_(v) at the topE_(v) of the valence band becomes stepped and substantially reduced dueto the provision of the p-type InGaP buffer layer, and the holes h moreeasily exceed the discontinuity value ΔE_(v). The present invention alsoutilizes a p-type InGaP buffer layer based on this principle.

When the optical output of the above described kind of semiconductorlaser increases, the light leaking out from the waveguide is alsoabsorbed within the n-type GaAs buried layer 112, for example, togenerate the electron-hole pairs. Particularly since this kind ofsemiconductor laser reduces the thermal resistance, increases the stripewidth or makes the light distribution asymmetrical so as to produce anoutput which is larger compared to that produced by the conventionalsemiconductor laser, extremely large number of electron-hole pairs aregenerated when the semiconductor laser produces the large output eventhough the loss rate due to the light absorpsion is slight. Hence,effects of the extremely large number of electron-hole pairs must betaken fully into consideration in order to effectively utilize the largeoutput characteristic of the semiconductor laser.

FIG. 41 shows an essential part of a semiconductor laser for explainingthe generation of the electron-hole pairs within the n-type GaAs buriedlayer 112. FIG. 41 corresponds to a part of the semiconductor lasershown in FIG. 37, and in FIG. 41, the same designations are used as inFIGS. 38 through 40.

FIG. 42 shows an energy band diagram taken along a line Y--Y in FIG. 41.In FIG. 42, E_(F) denotes a Fermi level and e denotes electrons.

In the state shown in FIG. 42, the n-type GaAs buried layer 112 absorbsthe light and generates the electron-hole pairs, and the electrons e aretrapped and accumulated within the potential well of the n-type GaAsburied layer 112. These electrons e reduce the potential wall withrespect to the holes h at the n-type GaAs buried layer 112.

FIG. 43 shows an energy band diagram for explaining the reduction of thepotential wall with respect to the holes h at the n-type GaAs buriedlayer 112. In FIG. 43, the same designations are used as in FIG. 42.

As shown in FIG. 43, the barrier height at the bottom E_(v) of thevalence band decreases because the electrons e are trapped by thepotential well of the n-type GaAs buried layer 112. Hence, by theso-called photo transistor operation, the holes h are injected from thep-type GaAs substrate 111 over the n-type GaAs buried layer 112 andcause a leak current in the semiconductor laser. In this case, thep-type InGaP buffer layer 114 which is provided to reduce the operationvoltage also acts similarly with respect to the leak current, that is,acts to increase the leak current even responsive to a small potentialchange.

In order to overcome the problem caused by the p-type InGaP buffer layer114, the current spread should be limited and the n-type GaAs buriedlayer should make direct contact with a p-type AlGaInP cladding layer115' at only the current confinement part.

Next, a description will be given of a sixth embodiment of thesemiconductor laser according to the present invention in which thestructure of the p-type InaP buffer layer 114 is modified, by referringto FIG. 44. In FIG. 44, those parts which are the same as thosecorresponding parts in FIGS. 37 and 41 are designated by the samereference numerals, and a description thereof will be omitted. In thisembodiment, a p-type InGaP buffer layer 122 is provided.

The semiconductor laser shown in FIG. 44 can be produced with ease basedon the processes described in conjunction with FIGS. 27 through 33. Whenforming the p-type GaAs substrate 111 into the shaped substrate, themesa etching of the p-type GaAs substrate 111 is made after forming thep-type InGaP buffer layer 122 on the p-type GaAs substrate 111. When thethickness of the p-type InGaP buffer layer 122 is 40 nm or less, it ispossible to obtain a satisfactory mesa structure for the buried layereven without employing the method of the present invention.

FIG. 45 shows an energy band diagram of the semiconductor laser shown inFIG. 44. In FIG. 45, the same designations are used as in FIGS. 42 and43.

As may be seen from FIG. 45, no p-type InGaP buffer layer 122 existsbetween the n-type GaAs buried layer 112 and the p-type AlGaInP claddinglayer 115'. Hence, the potential wall between the n-type GaAs buriedlayer 112 and the p-type AlGaInP cladding layer 115' is sufficientlyhigh, so that the leak current is reduced.

FIG. 46 shows a semiconductor laser for explaining a known technologyrelated to the embodiment shown in FIGS. 44 and 45.

As shown in FIG. 46, a p-type AlGaInP cladding layer CL_(p) us formed onthe top surface of an InGaP active layer AL, and a p-type InGaP bufferlayer BL is formed only between the top surface of the mesa formed bythe p-type AlGaInP cladding layer CL_(p) and a p-type GaAs contact layerCT. The p-type AlGaInP cladding layer CL_(p) and the p-type GaAs contactlayer CT make direct contact at parts other than the top surface of themesa. Hence, the current flows only at the top surface of the mesa dueto the difference in the potential walls.

The embodiment described in conjunction with FIGS. 44 and 45 is appliedwith a part of the known technology described in conjunction with FIG.46. However, unlike in FIG. 46, the current blocking part has a pnpstructure which is made up of the p-type GaAs substrate 111, the n-typeGaAs buried layer 112 and the p-type AlGaInP cladding layer 115. Hence,even when the operation temperature is high, it is possible toeffectively block the current utilizing the structure shown in FIG. 46.

It may be regarded that the problem of the stray photo transistoroperation may be eliminated by using, in place of the n-type GaAs,AlGaAs or AlGaInP which is transparent with respect to the wavelength ofthe emitting light for the buried layer which acts as the currentconfinement part.

FIG. 47 shows a semiconductor laser which includes a buried layer madeof AlGaAs (or AlGaInP). In FIG. 47, those parts which are the same asthose corresponding parts in FIGS. 37 through 41 are designated by thesame reference numerals, and a description thereof will be omitted.

In FIG. 47, a buried layer 123 is made of n-type AlGaAs, but it is alsopossible to use n-type AlGalnP in place of the n-type AlGaAs. However,the semiconductor laser shown in FIG. 47 suffers from the followingproblems.

First, when the current confinement part is made of a 3-element or4-element material, the thermal resistance of this part itself becomeslarge and the heat release characteristic becomes extremely poor.Second, because of the different buried layer material, it is difficultto form the buried layer with a satisfactory shape which was obtainablein the case of the n-type GaAs buried layer. In addition, when thesemiconductor layer is thereafter formed on the buried layer, thesemiconductor layer must be grown on a layer which includes Al.

Next, a description will be given of a seventh embodiment of thesemiconductor laser according to the present invention, by referring toFIG. 48. In FIG. 48, those parts which are the same as thosecorresponding parts in FIGS. 37 through 41 are designated by the samereference numerals, and a description thereof will be omitted.

According to this embodiment, the above described problems areeliminated by using a material having a wide energy band gap in a partof the n-type GaAs buried layer. In FIG. 48, an n-type GaAs buried layer124, an n-type AlGaInP buried layer 125 and an n-type GaAs buried layer126 are successively formed on the p-type GaAs substrate 111. In thisembodiment, the thickness and the like of each buried layer are asfollows.

Buried layer 124

Thickness: 0.5 μm

Impurity: Si

Impurity concentration: 3×10¹⁸ cm⁻³

Buried layer 125

Thickness: 500 to 1000 Å

Impurity: Si

Impurity concentration: 4×10¹⁷ cm⁻³

Buried layer 126

Thickness: 0.5 μm

Impurity: Si

Impurity concentration: 3×10¹⁸ cm⁻³

FIG. 49 shows an energy band diagram taken along a line Y--Y in FIG. 48.In FIG. 49, the same designations are used as in FIGS. 43 through 45 and48.

As shown in FIG. 49, the majority of the current confinement part isformed from GaAs so as to maintain the thermal resistance low, and theshape of the buried layer is maintained to a satisfactory shape.Furthermore, the injection of the holes is prevented by providing anAlGaInP layer which has a sufficient thickness and a wide energy bandgap to act as a barrier for the carriers.

FIG. 50 shows an energy band diagram for explaining the photo transistoroperation of the semiconductor laser described in conjunction with FIGS.48 and 49. In FIG. 50, the same designations are used as in FIGS. 48 and49. In FIG. 50, E_(FB) denotes a Fermi level within the buried layerwhich is changed by the photo transistor operation.

In this embodiment, the potential barrier described in conjunction withFIG. 39 is introduced at the current confinement part.

FIG. 50 shows a state where the electrons e are trapped in the n-typeGaAs buried layers 124 and 126 and a potential change occurs due to thephoto transistor operation. But even in this case, it can be seen thatthe barrier of the n-type AlGaInP buried layer 125 which has the wideenergy band gap blocks the injection of the holes h. In addition, sincethe top of the buried layers is the n-type GaAs buried layer 126, it ispossible to prevent the semiconductor layer from being formed on a layerwhich includes Al.

Next, a description will be given of an eighth embodiment of thesemiconductor laser according to the present invention, by referring toFIG. 51. In FIG. 51, the same designations are used as in FIGS. 48through 50. In this embodiment, a plurality of n-type AlGaInP buriedlayers having the wide energy band gap as described in conjunction withFIGS. 48 through 50 are provided. In FIG. 51, 125A and 125B respectivelydenote n-type AlGaInP buried layers.

In this case, the n-type AlGaInP buried layers 125A and 125Brespectively have a thickness of 500 Å and are separated from each otherby 500 Å, for example. According to this structure, the carriersinjected from the p-type GaAs substrate 111 must overcome a plurality ofpotential walls, and the recombination rate of the carriers increasesdue to the deep interface state formed at the interface of the buriedlayers 125A and 125B. As a result, it is possible to in effect reducethe change of the Fermi level E_(FB) and more positively suppress thephoto transistor operation, thereby making this structure suited forproducing a large output.

FIG. 52 shows an energy band diagram for explaining a ninth embodimentof the semiconductor laser according to the present invention. In thisembodiment, AlGaInP is used as the n-type buried layer material whichhas a wide energy band gap as in the case of the embodiments describedin conjunction with FIGS. 48 through 51, but the composition of theburied layer successively changes in this embodiment. In FIG. 52, thesame designations are used as in FIGS. 48 through 51. The compositionsuccessively changes in an n-type AlGaInPAs buried layer 125C shown inFIG. 52.

For example, the buried layer 125C has a thickness of 500 Å so that asatisfactory surface morphology is obtained when actually growing theburied layer 125C by a MOVPE. The satisfactory surface morphology can beobtained under a wide range of growth conditions because the group Velement composition successively changes in the material used so that nointerface is generated where the group V element having the relativelylimited growth conditions changes from As to P or P to As.

When the stripe width is set large as in the above described embodimentsso as to produce a large output, the cross section of the emitted laserbeam becomes an oval shape which is elongated in the vertical direction.However, when carrying out the high density storage on the disk usingthe semiconductor laser as the light source, it is desirable that thecross section of the emitted laser beam is approximately circular.Hence, it is possible to consider reducing the stripe width, but in thiscase, the light density at the laser edge facet increases and the CODbreakdown easily occurs. In addition, since the current density to thestripe part becomes extremely large, a considerable temperature riseoccurs at the stripe part and the output of the semiconductor laserbecomes restricted by the thermal saturation. This problem caused by thethermal saturation becomes conspicuous particularly when the claddinglayer is made of a 4-element compound semiconductor having a largethermal resistance, such as AlGaInP.

Accordingly, the present inventors tested a conventional mesa structureof a GaAs substrate shown in FIG. 53 in order to simultaneouslyeliminate the problem of the cross sectional shape of the laser beam andthe problem of the heat release. In other words, the stripe width ismade small only in a vicinity of the laser edge facet. In FIG. 53, thoseparts which are the same as those corresponding parts in FIG. 35 aredesignated by the same reference numerals, and a description thereofwill be omitted.

FIG. 54 (A) shows a cross section taken along a line c--c' in FIG. 53,and FIG. 54 (B) shows a cross section taken along a line d--d' in FIG.53. Since the (111)A face of the p-type GaAs substrate 101 is exposed atthe part where the stripe width becomes large as shown in FIG. 54 (B),the n-type GaAs buried layer 102 grows and forms a shape which projectsupwardly. For this reason, it becomes extremely difficult to control theshape of the double heterostructure which is formed above the structureshown in FIG. 54 (B).

Next, descriptions will be given of embodiments which can simultaneouslyeliminate the problem of the cross sectional shape of the laser beam andthe problem of the heat release.

FIG. 58 shows a tenth embodiment of the semiconductor laser according tothe present invention. A description will be given of a secondembodiment of the method of producing the semiconductor laser accordingto the present invention for producing the tenth embodiment ofsemiconductor laser, by referring to FIGS. 55 through 58. In FIGS. 55through 58, those parts which are the same as those corresponding partsin FIG. 36 are designated by the same reference numerals, and adescription thereof will be omitted.

First, the structure shown in FIG. 55 is formed by carrying outprocesses similar to those described in conjunction with FIGS. 27through 29. In other words, the SiO₂ layer 91 is formed on the (100)face of the p-type GaAs substrate 101 by a sputtering. The normalphotolithography technique is used to form a stripe pattern by apatterning. This stripe pattern has a wide part 91A which has a width of9 μm, for example, and a narrow part 91B which has a width of 6 μm, forexample, where the widths are taken along the <110> direction. The widepart 91A and the narrow part 91B are connected by a tapered part 91Cwhich has a length of approximately 50 μm. The resist pattern which isused for this patterning is used as a mask when etching the SiO₂ layer91 by a hydrofluoric acid buffer solution, and the resist is thereafterremoved. Next, the SiO₂ layer 92 is used as a mask to etch the p-typeGaAs substrate 101 by a mixed etchant of H₂ SO₄ +H₂ O₂ +H₂ O which isheated to approximately 50°0 C., so as to remove approximately 2 μm ofthe SiO₂ layer 91. As a result, approximately the (111)B face appears atthe mesa side surface, and the top surface of the mesa structure has awide part 101A having a width of approximately 4.8 μm and a narrow part101B having a width of approximately 1.8 μm, where the widths are takenalong the <110> direction.

Next, the eaves of the SiO₂ layer 91 is removed so that a buried layerhaving a satisfactory shape can be formed in the subsequent process. Theremoval of the eaves of approximately 2 μm is carried out by an etchingusing an etchant which has approximately the same etching rate for SiO₂and GaAs. For example, the etchant is a mixed solution of H₂ SO₄ +H₂ O₂+NH₄ F+HF+H₂ O, and the etching time is set so that approximately halfthe thickness of the SiO₂ layer 91 is removed by the etching.

Thereafter, the remaining SiO₂ layer 91 is used as a mask to selectivelygrow the n-type GaAs buried layer 102 to a thickness of 1 μm using anMOVPE. Hence, a trapezoidal mesa having the (311)B face as its slopingsurface is formed as shown in FIG. 56.

Then, the SiO₂ layer 91 is removed as shown in FIG. 57 usinghydrofluoric acid (HF). Furthermore, the p-type GaAs buffer layer 110,the p-type InGaP buffer layer 103, the p-type AlGaInP cladding layer104, the InGaP active layer 105, the n-type AlGaInP cladding layer 106and the n-type GaAs contact layer 107 are successively formed on thestructure shown in FIG. 57.

Therefore, the semiconductor laser shown in FIG. 58 is formed. The widthof the InGaP active layer 105 in the <110> direction is approximately6.4 μm at the wide part 101A and approximately 2.4 μm at the narrow part101B.

According to this embodiment, the n-type GaAs buried layer 102 for thecurrent confinement is formed on the sloping surface of the mesastructure which is approximately the (111)B face, even at the taperedpart 101C of the p-type GaAs substrate 101. Hence, the shape of theburied layer 102 is satisfactory throughout the entire region of thestripe. For this reason, the thermal saturation of the laser operationis suppressed at the wide part of the stripe, while the laseroscillation is such that the cross sectional shape of the laser beam issatisfactory at the laser edge facet, that is, at the narrow part of thestripe.

In this embodiment, the laser edge facet is provided at the tapered part101C as shown in FIG. 59. However, as a modification of this tenthembodiment, a straight part 101D may be connected to the tapered part101C, and the laser edge facet may be provided at the straight part 101Das shown in FIG. 60.

FIG. 65 shows an eleventh embodiment of the semiconductor laseraccording to the present invention. A description will be given of athird embodiment of the method of producing the semiconductor laseraccording to the present invention for producing the eleventh embodimentof semiconductor laser, by referring to FIGS. 61 through 65. In FIGS. 61through 65, those parts which are the same as those corresponding partsin FIG. 36 are designated by the same reference numerals, and adescription thereof will be omitted.

First, the SiO₂ layer 91 is used as a mask to etch approximately 2 μm ofthe p-type GaAs substrate 101. The SiO₂ layer 91 has a wide part 91Ahaving a width of approximately 9 μm and a narrow part 91B having awidth of approximately 4.5 μm, where the widths are taken along the<110> direction. FIG. 66 (a) shows a cross section along a line a1--a1'in FIG. 61, and FIG. 66 (b) shows a cross section along a line b1--b1'in FIG. 61.

Thereafter, the eaves of the SiO₂ layer 91 is removed as shown in FIG.62 using a process similar to that used in the second embodiment of themethod. Hence, a prism shaped part 101E of the p-type GaAs substrate 101is exposed, but the SiO₂ layer 91 remains on a mesa part 101F of thep-type GaAs substrate 101.

Then, the n-type GaAs buried layer 102 is grown to a thickness of 1 μmto obtain a structure shown in FIG. 63. FIG. 67 (A) shows a crosssection along a line a2--a2' in FIG. 63, and FIG. 67 (B) shows a crosssection along a line b2--b2' in FIG. 63.

As may be seen from FIG. 67, the n-type GaAs buried layer 102 is formedon the entire surface of the prism shaped part 101E of the p-type GaAssubstrate 101 and acts as a current confinement part. A non-excited partis formed on this current confinement part. The n-type GaAs buried layer102 formed on the prism shaped part 101E has a thickness ofapproximately 0.3 μm, and a height h₁ at the mesa part 101F isapproximately the same as a height h₂ at the prism shaped part 101E.

Next, the SiO₂ layer 91 is removed as shown in FIG. 64, and a doubleheterostructure similar to that shown in FIG. 58 is formed on the n-typeGaAs buried layer 102 as shown in FIG. 65. FIG. 68 shows a cross sectionalong a line a3--a3' in FIG. 65, and FIG. 69 shows a cross section alonga line b3--b3' in FIG. 65. As may be seen from FIGS. 65 and 68, theInGaP active layer 105 is substantially flat, and a window structure isobtained because the part above the n-type GaAs buried layer 102 becomesthe non-excited part. In addition, the InGaP active layer 105 whichbends along the prism shaped part 101E makes it possible to realize asatisfactory laser beam emission characteristic.

According to this embodiment, a current non-injecting part is providedin the vicinity of the laser edge facet, and the band gap becomes smallat the current injecting part due to the temperature rise and the like.Hence, the current non-injecting part essentially becomes the windowstructure, and the semiconductor laser can produce a large outputwithout introducing a breakdown at the laser edge facet.

As a modification of the eleventh embodiment of the semiconductor laser,it is possible to make the height h₂ of the prism shaped part 101E lowerthan the height h₁ of the mesa part 101F. A cross section of thismodification corresponding to FIG. 68 becomes as shown in FIG. 70. InFIG. 70, those parts which are the same as those corresponding parts inFIG. 68 are designated by the same reference numerals, and a descriptionthereof will be omitted. In this modification, the InGaP active layer105 bends in the vicinity of the laser edge facet.

According to this modification, a window structure is formed by theInGaP active layer 105 which bends in the vicinity of the laser edgefacet. Hence, the semiconductor laser can produce a large output withoutintroducing a breakdown at the laser edge facet. In FIG. 70, 106a, 106band 106c denote n-type AlGaInP cladding layers.

In the eleventh embodiment of the semiconductor laser and themodification thereof, the n-type AlGaInP cladding layer 106 is made of(Al_(x) Ga_(1-x))₀.5 In₀.5 P, for example. In this case, it is possibleto facilitate the propagation of the laser beam within the n-typeAlGaInP cladding layer 106 by guiding the light within the layer ofx=0.4, by using a sandwich structure having the layer of x=0.4sandwiched between layers of x=0.7.

In each of the embodiments of the method according to the presentinvention, the eaves of the SiO₂ layer 91 is removed using the etchantwhich can etch the GaAs and SiO₂ at approximately the same etchingrates. Accordingly, the shoulder part of the substrate mesa structureautomatically matches the end edge of the SiO₂ layer 91 which is used asthe mask, and it is possible to minimize the shape of the buried layerfrom being distorted by the eaves.

However, the coverage provided by the buried layer may be insufficientor excessive if the height of the substrate mesa structure and thethickness of the buried layer are not controlled accurately. If thecoverage provided by the buried layer is insufficient and the (111)Bface of the substrate mesa structure is exposed, it was experimentallyconfirmed that crystal defects occur when the AlGaInP system laser isformed on top of such a substrate mesa structure.

Accordingly, a description will now be given of a fourth embodiment ofthe method of producing the semiconductor laser according to the presentinvention, by referring to FIG. 71. This embodiment eliminates theproblem caused by the insufficient coverage of the buried layer. In FIG.71, those parts which are the same as those corresponding parts in FIG.26 are designated by the same reference numerals for the sake ofconvenience, and a description thereof will be omitted.

FIG. 71 (A) corresponds to FIG. 31, and shows a state where the coverageof the substrate mesa structure by the n-type GaAs buried layer 102 isinsufficient. In this embodiment, the p-type GaAs buffer layer 110 isformed on the structure shown in FIG. 71 (A), so that the exposed (111)Bface of the substrate mesa structure is covered by the p-type GaAsbuffer layer 110 as shown in FIG. 71 (B). Thereafter, the cladding layerand the like are formed as in the case of the previously describedembodiments.

However, even in the case of the fourth embodiment of the method, it isstill impossible to eliminate the problem caused by the excess coverageprovided by the buried layer. Hence, a description will be given of afifth embodiment of the method of producing the semiconductor laseraccording to the present invention, by referring to FIGS. 72 through 76.According to this embodiment, it is possible to eliminate the problemsof both the insufficient coverage and the excessive coverage provided bythe buried layer. In FIGS. 72 through 76, those parts which are the sameas those corresponding parts in FIG. 36 are designated by the samereference numerals, and a description thereof will be omitted.

FIGS. 72 and 73 respectively correspond to FIGS. 27 and 28. FIG. 72shows a state where the mesa etching of the p-type GaAs substrate 101 ismade using the stripe SiO₂ layer 91 as the mask. FIG. 73 shows a statewhere the eaves of the SiO₂ layer 91 is removed by an etching usingHF+NH₄ F as the etchant, for example.

In this embodiment, the p-type GaAs substrate 101 shown in FIG. 73 issubjected to an additional etching so as to form a depression 101G. Theadditional etching is carried out using a mixed solution of H₂ SO₄ +H₂O₂ +H₂ O which is heated to approximately 50° C. as the etchant, forexample. As shown in FIG. 74, the depression 101G is made up of the(100) face which connects to the (111)B face on the outer side of thesubstrate mesa structure and the (111)B face on the inner side of thesubstrate mesa structure. Eaves of approximately 0.3 μm or less isformed by the SiO₂ layer 91 by this additional etching, and an imaginaryline on the extension of the (111)B face on the outer side of thesubstrate mesa structure intersects the newly formed eaves.

Next, the n-type GaAs buried layer 102 is formed on the substrate mesastructure, and FIG. 75 shows a state where the n-type GaAs buried layer102 is formed halfway. As shown, the n-type GaAs does not grow on the(111)B face on the outer side of the substrate mesa structure nor on the(111)B face of the depression 101G on the inner side of the substratemesa structure, but the n-type GaAs grows on the (100) face of thedepression 101G. The n-type GaAs which grows on the (100) face of thedepression 101G stops growing when the surface of the grown layermatches the (111)B face on the outer side of the substrate mesastructure, and for this reason, the shape of the substrate mesastructure is substantially unaffected by the provision of the depression101G. As the growth of the n-type GaAs buried layer 102 progresses, then-type GaAs crawls on the sloping surface of the substrate mesastructure and the structure shown in FIG. 76 is obtained. FIG. 76corresponds to FIG. 30.

Therefore, according to the present invention, it is simply necessary toform the n-type GaAs buried layer 102 so as to prevent insufficientcoverage thereby. The excess coverage by the n-type GaAs buried layer102 is positively prevented by the newly formed eaves of the SiO₂ layer91. As may be seen from FIG. 76, the growth of the n-type GaAs buriedlayer 102 stops at the bottom surface of the eaves of the SiO₂ layer 91,and thus, it is possible to obtain the desired conventional mesa whilepreventing the (111)B face from being exposed.

Thereafter, the removal of the SiO₂ layer 91, the formation of thecladding layer and the like are made similarly as in the case of thepreviously described embodiments of the method. FIG. 77 shows aphotograph of the semiconductor laser produced by this embodiment, takenby an electron microscope, and corresponding to the cross section of thesemiconductor laser.

In this embodiment, the eaves of the SiO₂ layer 91 shown in FIG. 72 isonce removed before newly forming the eaves as shown in FIG. 74 for thefollowing reasons. That is, the eaves shown in FIG. 72 is approximately1 to 2 μm and too large. If the eaves shown in FIG. 72 were to bereduced to approximately 0.3 μm or less when the mesa etching is carriedout, the height and the like of the substrate mesa structure wouldbecome limited and the degree of freedom with which the semiconductorlaser may be designed would become greatly restricted.

According to further experiments conducted by the present inventors, itwas found that the shape of the double heterostructure changes dependingon the growth conditions when the double heterostructure made ofAlGaInP/GaInP system material is formed by the MOVPE on the trapezoidalmesa structure which is made up of the p-type GaAs substrate 101 and then-type GaAs buried layer 102 as shown in FIG. 36. It was also found thatamong the growth conditions the growth temperature most affects theshape of the double heterostructure. Other growth conditions such as theIII/V ratio (TMA, TMG, TMI etc./PH₃) and the growth rate did not affectthe shape of the double heterostructure as much as the growthtemperature, as long as these other conditions were within a certainrange such that a satisfactory surface morphology is guaranteed.

FIG. 78 (A) shows a double heterostructure which is produced at a growthtemperature of 690° C., and FIG. 78 (B) shows a double heterostructurewhich is produced at a growth temperature of 730° C. In FIG. 78, thoseparts which are the same as those corresponding parts in FIG. 36 aredesignated by the same reference numerals, and a description thereofwill be omitted. As may be seen by comparing FIG. 78 (A) and (B), thestripe width of the InGaP active layer 105 is considerably wide comparedto the width of the trapezoidal mesa structure when the growthtemperature is 690° C., but the stripe width is not as wide when thegrowth temperature is 730° C.

As shown in FIG. 78 (A), substantially all of the InGaP active layer 105is formed on the trapezoidal mesa structure via the p-type AlGaInPcladding layer 104 which is thicker than the n-type AlGaInP claddinglayer 106 when the growth temperature is 690° C. But the thermalconductivity of the AlGaInP system material is small because it is a4-element mixed crystal. For this reason, when substantially all of theInGaP active layer 105 makes contact with the p-type AlGaInP claddinglayer 104 which is thicker than the n-type AlGaInP cladding layer 106,it is impossible to efficiently release the heat generated from theInGaP active layer 105 to the GaAs trapezoidal mesa part, and the outputsaturation of the semiconductor laser occurs due to the heat when thesemiconductor laser is operated to produce a large output.

Next, a description will be given of a sixth embodiment of the method ofproducing the semiconductor laser according to the present invention, byreferring to FIGS. 79 through 85. According to this embodiment, theabove described problem caused by the effects of heat is eliminated. InFIGS. 79 through 85, those parts which are the same as thosecorresponding parts in FIG. 36 are designated by the same referencenumerals, and a description thereof will be omitted.

In FIG. 79, the SiO₂ layer 91 having a thickness of 2000 Å, for example,is formed on the p-type GaAs substrate 101. The main surface of thep-type GaAs substrate 101 is the (100) face, and the impurityconcentration of the p-type GaAs substrate 101 is 1×10¹⁹ cm⁻³.

Then, a resist process of a photolithography technique and a wet etchingusing HF/NH₄ F as the etchant are used to pattern the SiO₂ layer 91. Asa result, a stripe of the SiO₂ layer 91 is formed. This stripe SiO₂layer 91 extends in the <110> direction of the p-type GaAs substrate 101and has a width of 5 μm.

In FIG. 80, a wet etching is made using a H₂ SO₄ +H₂ O₂ +H₂ O etchantwhich is heated to approximately 50° C., so as to carry out a mesaetching of the p-type GaAs substrate 101 using the stripe SiO₂ layer 91as a mask. Hence, a mesa having a height of approximately 2 μm and awidth of approximately 1.8 μm at the top of the mesa is formed, wherethe width is taken along the <110> direction. The (111)B face appears atthe sloping surface of the mesa.

In FIG. 81, a wet etching is made using a H₂ SO₄ +H₂ O₂ +NH₄ OH+NH₄ F+H₂O etchant so as to remove the eaves of approximately 2 μm of the SiO₂layer 91. The etchant used in this case has approximately the sameetching rates for the SiO₂ and GaAs, and the eaves is removed by etchingapproximately half the thickness of the SiO₂ layer 91.

In FIG. 82, the remaining SiO₂ layer is used as a mask and an MOVPE isused to grow the n-type GaAs buried layer 102 to a thickness of 0.9 μmfor example. The impurity of the n-type GaAs buried layer 102 is Si, andthe impurity concentration is 3×10¹⁸ cm⁻³, for example. Hence, atrapezoidal mesa having the (311)B face as its sloping surface isformed.

Then, the structure shown in FIG. 82 is submerged into a HF etchant toremove the SiO₂ layer as shown in FIG. 83.

In FIG. 84, the p-type GaAs buffer layer 110, the p-type InGaP bufferlayer 103, the p-type AlGaInP cladding layer 104, the InGaP active layer105, the n-type AlGaInP cladding layer 106 and the n-type GaAs contactlayer 107 are successively formed by an MOVPE at a growth temperature of710° to 800° C. As a result, a semiconductor laser in which the InGaPactive layer 105 has a width of approximately 2.4 μm in the <110>direction is formed.

In this embodiment, the thickness and the like of each semiconductorlayer are as follows.

Buffer layer 110

Thickness: 300 Å

Impurity: Zn

Impurity concentration: 1×10¹⁸ cm⁻³

Buffer layer 103

Thickness: 0.1 μm

Impurity: Zn

Impurity concentration: 1×10¹⁸ cm⁻³

Cladding layer 104

Thickness: 1 μm

Impurity: Zn

Impurity concentration: 3×10¹⁷ cm⁻³

Active layer 105

Thickness: 0.07 μm

Cladding layer 106

Thickness 1 μm

Impurity: Si

Impurity concentration: 3×10¹⁷ cm⁻³

Contact layer 107

Thickness: 1 μm

Impurity: Si

Impurity concentration: 3×10¹⁷ cm⁻³

In FIG. 85, the p side electrode 109 is formed by successively stackingAu/Zn/Au by vacuum deposition. Similarly, the n side electrode 108 isformed by successively stacking Au/AuGe by vacuum deposition.Thereafter, the electrodes 109 and 108 are alloyed at 430° C., and thesemiconductor laser is completed by forming a cavity length of 300 μm,for example. The semiconductor laser which is completed is basically thesame as the semiconductor laser shown in FIG. 36.

When the growth temperature becomes high, it becomes difficult to reducethe resistance of the p-type layer in the case of the AlGaInP/GaInPsystem material. Hence, it is necessary to inject the p-type impuritieswith a high dosage, but in this case, the change in the junctionposition due to the diffusion of the p-type impurities during the growthprocess no longer becomes negligible. Accordingly, the growthtemperature is

desirably in the range of 710° to 750° C.

In the embodiments described heretofore, the substrate is made of GaAsand the AlGaInP system double heterostructure is formed thereon.However, it is of course possible to use a substrate made of InP, forexample, when applying the present invention, and a semiconductor laserwhich has similar advantageous effects is obtainable in this case. Forexample, when a p-type InP substrate 101 is used in the embodiment shownin FIG. 35, it is possible to use a p-type InP cladding layer 104, anInGaAsP active layer 105, an n-type InP cladding layer 106, an n-typeInGaAsP contact layer 107, a AuGe/Au n side electrode 108 and a Au/Zn/Aup side electrode 109. In addition, it is possible to use n-type InGaAsor AlInAs for the buried layer 102. In this case, the cladding layer 104is made of a 2-element compound semiconductor, and it is unnecessary toprovide a buffer layer 103 because of the wider range of growthconditions for obtaining the satisfactory growth morphology.

In addition, when the p-type InP substrate 101 is used in the embodimentshown in FIG. 35, it is possible to use a p-type InP buffer layer 103, ap-type InAlAs cladding layer 104, an InGaAs active layer 105, an n-typeAlInAs cladding layer 106, an n-type InGaAs contact layer 107, a AuGe/Aun side electrode 108 and a Au/Zn/Au p side electrode 109. In this case,n-type InGaAs or AlInAs may be used for the buried layer 102.

Furthermore, when providing the guide layer 117 as in the case of theembodiment shown in FIG. 37, it is possible to form on a p-type InPsubstrate 111 an n-type InGaAs buried layer 112, a p-type InP claddinglayer 115, a InGaAsP active layer 116, an n-type InGaAsP guide layer117, an n-type InP cladding layer 118 and an n-type InGaAsP contactlayer 119. AuGe/Au and Au/Zn/Au can respectively be used for theelectrodes 120 and 121. In addition, buffer layers 113 and 114 areunnecessary in this case.

Next, a description will be given of the operating principle of aseventh embodiment of the method of producing the semiconductor laseraccording to the present invention, by referring to FIGS. 86 through 88.

In FIG. 86, an insulator layer 202 made of SiO₂ for example, is formedon a GaAs substrate 201. The insulator layer 202 is etched to form astripe opening 202A in the <110> direction of the GaAs substrate 201.

In FIG. 87, a GaAs layer 203 is formed on the GaAs substrate 201 whichis exposed within the stripe opening 202A by using a low pressure MOVPE.This GaAs layer 203 has a trapezoidal cross section in an initial stageof the growth process, but eventually assumes a triangular cross sectionas shown as the growth process progresses, and the sloping surface ofthe triangular cross section is the (111)B face.

In FIG. 88, the insulator layer 202 which is used as the mask for theselective growth process is removed. Thereafter, a desired semiconductorlayer such as a GaAs, AlGaAs, GaInP or AlGaInP layer is grown, and thissemiconductor layer is denoted by a reference numeral 204 in FIG. 88. Abent part 204B is generated on both sides of a stripe part 204A whichcorresponds to a waveguide. Accordingly, when an active layer, acladding layer and the like are grown on top of this semiconductor layer204, the refractive index clearly changes when viewed in the lateraldirection from the stripe part 204A. The sloping surface at the bentpart 204B is the (311)B face.

Next, a description will be given of the seventh embodiment of themethod of producing the semiconductor laser according to the presentinvention, by referring to FIGS. 89 through 92.

In FIG. 89, a chemical vapor deposition (CVD) is used to form a SiO₂insulator layer 206 having a thickness of approximately 2000 Å, forexample, on an n-type GaAs substrate 205. The insulator layer 206 may ofcourse be made of a material other than SiO₂ , such as SiN.

A resist process of a photolithography technique and a reactive ionetching (RIE) using CF₄ 214) or CHF₃ etching gas are used to etch theinsulator layer 206 and form a stripe opening 206A which extends in the<110> direction of the n-type GaAs substrate 205 and has a width of 2μm, for example.

In FIG. 90, a low pressure MOVPE is used to grow an n-type GaAs layer207 on the n-type GaAs substrate 205 which is exposed within the stripeopening 206A. When the stripe opening 206A has the width of 2 μm, thecross section of the grown n-type GaAs layer 207 becomes triangular asshown when the growth temperature is 690° C. and the growth time is 15minutes. The sloping surface of the n-type GaAs layer 207 is the (111)Bface, and the maximum thickness (height) of the n-type GaAs layer 207 is1.38 μm.

The structure shown in FIG. 90 is submerged into a hydrofluoric acidsystem etchant so as to remove the insulator layer 206 which is used asthe mask during the selective growth process. Then, a low pressure MOVPEis used to successively form a blocking layer 211, a cladding layer 212,an active layer 213, a cladding layer 214 and an electrode contact layer215 as shown in FIG. 91. As a result, a bent part 213B is formed on bothsides of a stripe part 213A, and the index of diffraction changes whenviewed laterally from the active layer 213 or the stripe part 213A inthe vicinity thereof. This change in the index of diffraction may beutilized to trap the light. The sloping surface of the bent part 213B isthe (311)B face.

In this embodiment, the thickness and the like of each semiconductorlayer are as follows.

Blocking layer 211

Material: p-type GaAs

Impurity concentration: 1×10¹⁸ cm⁻³

Thickness: 0.5 μm

Cladding layer 212

Material n-type AlGaInP

Impurity concentration: 7×10¹⁷ cm⁻³

Thickness: 1 μm

Active layer 213

Material: Non-doped InGaP

Thickness: 0.07 μm

Cladding layer 214

Material: p-type AlGaInP

Impurity concentration: 3×10¹⁷ cm⁻³

Thickness: 1 μm

Electrode contact layer 215

Material: p-type GaAs

Impurity concentration: 1×10¹⁹ cm⁻³

Thickness: 0.5 μm

In FIG. 92, a vacuum deposition is used, for example, to form a p sideelectrode 216P of Ti/Pt/Au and an n side electrode 216N of AuGe/Au, andthe semiconductor laser is completed.

Next, a description will be given of an eighth embodiment of the methodof producing the semiconductor laser according to the present invention,by referring to FIGS. 93 through 101. In FIGS. 93 through 101, thoseparts which are the same as those corresponding parts in FIGS. 89through 92 are designated by the same reference numerals, and adescription thereof will be omitted.

In FIG. 93, a CVD is used to form the SiO₂ insulator layer 206 having athickness of 2000 Å, for example, on the n-type GaAs substrate 205.Then, a resist process of a photolithography technique and a RIE usingCF₄ or CHF₃ etching gas are used to etch the insulator layer 206 to formthe stripe opening 206A. This stripe opening 206A extends in the <110>direction of the n-type GaAs substrate 205 and has a width of 3 μm, forexample.

In FIG. 94, a low pressure MOVPE is used to grow the n-type GaAs layer207 on the n-type GaAs substrate 205 which is exposed within the stripeopening 206A. When the stripe opening 206A has the width of 3 μm, thecross section of the grown n-type GaAs layer 207 becomes trapezoidal asshown when the growth temperature is 690° C. and the growth time is 15minutes. The sloping surface of the n-type GaAs layer 207 is the (111)Bface, and the maximum thickness (height) of the n-type GaAs layer 207 is1.5 μm.

The structure shown in FIG. 94 is submerged into a hydrofluoric acidsystem etchant so as to remove the insulator layer 206 which is used asthe mask during the selective growth process, as shown in FIG. 95. Then,a resist process of a photolithography technique is used to form aphotoresist layer 208 having an opening with the same width as thestripe of the n-type GaAs layer 207. Thereafter, a spin-coating processis used to further form a photoresist layer 209 so as to smoothen thesurface.

In FIG. 96, an ashing process using oxygen plasma is used to subject thephotoresist layer 209 to an ashing and expose the top surface of then-type GaAs layer 207.

In FIG. 97, a CVD is used to form an insulator layer 210 made of SiO₂ toa thickness of 2000 Å, for example.

In FIG. 98, a resist process of a photolithography technique and a RIEusing CF₄ or CHF₃ etching gas are used to pattern the insulator layer210. Hence, only the part of the insulator layer 210 covering the n-typeGaAs layer 207 remains and the other parts of the insulator layer 210are removed by the patterning. In addition, an ashing process usingoxygen plasma is used to remove the photoresist layers 209 and 208, soas to expose the side surfaces of the n-type GaAs substrate 205 and then-type GaAs layer 207.

In FIG. 99, a low pressure MOVPE is used to successively form theblocking layer 211. As shown, the blocking layer 211 enters below theinsulator layer 210 in the vicinity of the side surface of the n-typeGaAs layer 207. The thickness and the like of the blocking layer 211 areas follows.

Blocking layer

Material: p-type GaAs

Impurity concentration: 1×10¹⁸ cm⁻³

Thickness: 0.5 μm

In FIG. 100, the structure shown in FIG. 99 is submerged into ahydrofluoric acid etchant to remove the insulator layer 210 which isused as a mask when forming the blocking layer 211. In addition, a lowpressure MOVPE is used to successively form the cladding layer 212, theactive layer 213, the cladding layer 214 and the electrode contact layer215. As a result, the bent part 213B is formed on both sides of thestripe part 213A, and the index of diffraction changes when viewedlaterally from the active layer 213 or the stripe part 213A in thevicinity thereof. This change in the index of diffraction may beutilized to trap the light. The sloping surface of the bent part 213B isthe (311)B face.

The thickness and the like of each layer grown on the blocking layer 211are as follows.

Cladding layer 212

Material: n-type AlGaInP

Impurity concentration: 7×10¹⁷ cm⁻³

Thickness: 1 μm

Active layer 213

Material: Non-doped InGaP

Thickness: 0.07 μm

Cladding layer 214

Material: p-type AlGaInP

Impurity concentration: 3×10¹⁷ cm⁻³

Thickness: 1 μm

Electrode contact layer 215

Material: p-type GaAs

Impurity concentration: 1×10¹⁹ cm⁻³

Thickness: 0.5 μm

In FIG. 101, a vacuum deposition is used, for example, to form the pside electrode 216P of Ti/Pt/Au and the n side electrode 261N ofAuGe/Au, and the semiconductor laser is completed.

According to this embodiment, the cross sectional shape of the n-typeGaAs layer 207 is trapezoidal. For this reason, it is possible to makethe thickness of the cladding layer 212 which is formed above the n-typeGaAs layer 207 extremely thin, and thus reduce the thermal resistance.

In the sixth and seventh embodiments of the method according to thepresent invention, the n-type GaAs is used as the substrate material.However, it is of course possible to use a p-type GaAs as the substratematerial. In this case, the conductor types of each semiconductor layermust be reversed from p-type to n-type or vice versa.

FIG. 102 shows a semiconductor laser which is produced by a ninthembodiment of the method of producing the semiconductor laser accordingto the present invention. In FIG. 102, those parts which are the same asthose corresponding parts in FIGS. 89 through 92 are designated by thesame reference numerals, and a description thereof will be omitted.

In FIG. 102, the semiconductor laser includes a p-type GaAs substrate217, a p-type GaAs layer 218, an n-type GaAs blocking layer 219, ap-type AlGaInP cladding layer 220, a non-doped InGaP active layer 221,an n-type AlGaInP cladding layer 222 and an n-type GaAs electrodecontact layer 223.

The semiconductor laser shown in FIG. 102 differs from the semiconductorlaser shown in FIG. 101, for example, only in that the p-type GaAssubstrate material is used for the substrate 217 and the semiconductorlayers formed thereof have the opposite conductor types when compared tothe semiconductor laser shown in FIG. 101. Hence, the semiconductorlaser shown in FIG. 102 can be produced by processes similar to thosedescribed with reference to FIGS. 91 through 101.

According to the sixth through eighth embodiments of the method of thepresent invention, the stripe projection part which becomes the base forforming the stripe part which acts as the waveguide and the bent partswhich trap the light is not formed by an etching. Instead, the stripeprojection part is grown on a substrate having a satisfactory crystalorientation. Hence, the semiconductor layers formed on such a substratewill not include crystal defects, and it becomes possible to realize asemiconductor laser having a high performance free of abberation loss orthe like.

Further, the present invention is not limited to these embodiments, butvarious variations and modifications may be made without departing fromthe scope of the present invention.

What is claimed is:
 1. A method of producing a semiconductor lasercomprising the steps of:(a) patterning a dielectric layer which isformed on a (100) face of a substrate into a stripe; (b) forming astripe of a first mesa by making a mesa etching of the substrate usingthe stripe of the dielectric layer as a mask, said stripe of the firstmesa including a (111)B face as its sloping surface; (c) removing eavesof the dielectric layer which is used as the mask in said step (b) by anetching; (d) forming a buried layer by a metal organic vapor phaseepitaxy (MOVPE) using the remaining dielectric layer as a mask so thatthe buried layer is formed on said substrate excluding a top surface ofthe stripe of the first mesa and the (111)B face of the stripe of thefirst mesa is covered a sloping surface part of said buried layer, saidtop surface of the stripe of the first mesa being the (100) face of thesubstrate and forming a stripe of a second mesa together with thesloping surface of said buried layer, said stripe of the second mesahaving a smaller inclination than said stripe of the first mesa; (e)removing the dielectric layer by an etching; and (f) forming a doubleheterostructure made up of a plurality of semiconductor layers on thestripe of the second mesa by a metal organic vapor phase epitaxy(MOVPE), said double heterostructure including an active layer and firstand second cladding layers which sandwich the active layer, and isprovided along the (100) face of the first mesa and along the slopingsurface of the second mesa.
 2. The method of producing the semiconductorlaser as claimed in claim 1, wherein said step (c) uses am etchant whichetches both the dielectric layer and the substrate.
 3. The method ofproducing the semiconductor laser as claimed in claim 2, wherein saidetchant has approximately the same etching rate with respect to thedielectric layer and the substrate.
 4. The method of producing thesemiconductor laser as claimed in claim 1, which further comprises thestep (g) of forming a buffer layer between the stripe of the second mesaand the double heterostructure.
 5. The method of producing thesemiconductor laser as claimed in claim 1, wherein said step (a)patterns the dielectric layer so that a width along the <110> directionis tapered and decreases towards an edge surface of the semiconductorlaser.
 6. The method of producing the semiconductor laser as claimed inclaim 5, wherein said step (c) removes the eaves so that the width ofthe stripe of the dielectric layer along the <110> direction becomeszero in a vicinity of the edge surface of the semiconductor laser. 7.The method of producing the semiconductor laser as claimed in claim 1,wherein said step (f) forms each of the semiconductor layers at a growthtemperature in the range of 710° to 800° C.
 8. The method of producingthe semiconductor laser as claimed in claim 1, which further comprisesthe step (g) of removing a part of the stripe of the first mesa by anadditional etching prior to said step (c) so that eaves of apredetermined length is formed by the dielectric layer.
 9. The method ofproducing the semiconductor laser as claimed in claim 8, wherein saidstep (d) forms the buried layer so that the buried layer completelycovers the (111)B face at the sloping surface of of the stripe of thefirst mesa.
 10. The method of producing the semiconductor laser asclaimed in claim 1, wherein the substrate is made of GaAs, and theburied layer is made of a material selected from a group consisting ofGaAs and AlGaAs.
 11. The method of producing the semiconductor laser asclaimed in claim 10, wherein the buried layer is of a conductor typeopposite to that of the substrate or has a resistance which is highcompared to that of the substrate.
 12. The method of producing thesemiconductor laser as claimed in claim 10, wherein said active layer ismade of a material selected from a group consisting of InGaP andAlGaInP, and said first and second cladding layers are made of amaterial selected from a group consisting of AlGaInP and AlInP ofmutually opposite conductor types and having an energy band gap greaterthan that of the active layer.
 13. The method of producing thesemiconductor laser as claimed in claim 12, wherein said step (f) formsthe first and second cladding layers at a growth temperature in a rangeof 710° to 800° C.
 14. The method of producing the semiconductor laseras claimed in claim 1, wherein the substrate is made of GaAs, and saidstep (a) forms the dielectric layer on the (100) face of the substrateby a sputtering.
 15. The method of producing the semiconductor laser asclaimed in claim 1, wherein the substrate is made of GaAs, and said step(b) forms the stripe of the first mesa using as an etchant a mixedsolution of H₂ SO₄, H₂ O₂ and H₂ O, said etchant in use being heated toapproximately 50° C.
 16. The method of producing the semiconductor laseras claimed in claim 1, wherein the substrate is made of InP, and theburied layer is made of a material selected from a group consisting ofInGaAs and AlInAs.
 17. The method of producing the semiconductor laseras claimed in claim 16, wherein the buried layer is of a conductor typeopposite to that of the substrate.
 18. The method of producing thesemiconductor laser as claimed in claim 16, wherein the doubleheterostructure includes an active layer and first and second claddinglayers which sandwich the active layer, said active layer is made of amaterial selected from a group consisting of InGaAs and AlGaAsP, andsaid first and second cladding layers are made of a material selectedfrom a group consisting of InGaAsP, InP and AlInAs of mutually oppositeconductor types and having an energy band gap greater than that of theactive layer.
 19. A method of producing a semiconductor laser comprisingthe steps of:(a) patterning a dielectric layer which is formed on a mainsurface of a substrate into a stripe; (b) forming a stripe of a firstmesa by making a mesa etching of the substrate using the stripe of thedielectric layer as a mask, said stripe of the first mesa having a topsurface and a sloping surface; (c) removing eaves of the dielectriclayer which is used as the mask in said step (b) by an etching; (d)forming a buried layer by a metal organic vapor phase epitaxy (MOVPE)using the remaining dielectric layer as a mask so that the buried layeris formed on said substrate excluding the top surface of the stripe ofthe first mesa and the sloping surface of the stripe of the first mesais covered a sloping surface part of said buried layer, said step (d)being carried out under conditions such that the growth rate of theburied layer on the sloping surface of the stripe of the first mesa isslower than that at other parts of the substrate, said top surface ofthe stripe of the first mesa forming a stripe of a second mesa togetherwith the sloping surface of said buried layer, said stripe of the secondmesa having a smaller inclination than said stripe of the first mesa;(e) removing the dielectric layer by an etching; and (f) forming adouble heterostructure made up of a plurality of semiconductor layers onthe stripe of the second mesa by a metal organic vapor phase epitaxy(MOVPE), said double heterostructure including an active layer and firstand second cladding layers which sandwich the active layer, and isprovided along the main face of the first mesa and along the slopingsurface of the second mesa.
 20. A method of producing a semiconductorlaser comprising the steps of:(a) forming on a substrate a mask having astripe opening which extends in a <110> direction of the substrate, saidsubstrate being made of a compound semiconductor of a first conductortype; (b) forming a stripe projection part on the substrate which isexposed within the stripe opening by a metal organic vapor phase epitaxy(MOVPE), said stripe projection part having one of a triangular and atrapezoidal cross section with a (111)B face as its sloping surface andbeing made of a compound semiconductor; (c) forming a blocking layer onthe substrate by a metal organic vapor phase epitaxy (MOVPE) so as tocover the (111)B face under a predetermined condition such that a growthrate of the blocking layer on the sloping surface of the stripeprojection part is slower than that at other parts of the substrate; and(d) forming a stripe part which acts as a wave guide and a bent partprovided on both sides of the stripe part for trapping light bysuccessively growing a first cladding layer, an active layer and asecond cladding layer, said stripe part being formed above said stripeprojection part, said bent part having a (311)B face as its slopingsurface, said first and second cladding layers being respectively madeof mutually opposite first and second conductor types.